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CXXXXT420-SXX00-A Scheda tecnica(PDF) 1 Page - Cree, Inc

Il numero della parte CXXXXT420-SXX00-A
Spiegazioni elettronici  XThin짰 LEDs
Download  4 Pages
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Produttore elettronici  CREE [Cree, Inc]
Homepage  http://www.cree.com/
Logo CREE - Cree, Inc

CXXXXT420-SXX00-A Scheda tecnica(HTML) 1 Page - Cree, Inc

  CXXXXT420-SXX00-A Datasheet HTML 1Page - Cree, Inc CXXXXT420-SXX00-A Datasheet HTML 2Page - Cree, Inc CXXXXT420-SXX00-A Datasheet HTML 3Page - Cree, Inc CXXXXT420-SXX00-A Datasheet HTML 4Page - Cree, Inc  
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Subject to change without notice.
www.cree.com
FEATURES
XThin LED Performance
450 nm – 24 mW min.
Low Forward Voltage
Single Wire Bond Structure
Class 2 ESD Rating
APPLICATIONS
LCD Backlighting
Digital Camera Flash for Mobile Appliance
LED Video Displays
Audio Product Display Lighting
XThin® LEDs
CxxxXT420-Sxx00-A
Cree’s XThin LEDs are the next generation of solid-state LEDs that combine highly efficient InGaN materials with Cree’s
proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a
geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single wire bond
connection. These vertically structured LED chips are approximately 175 microns in height and require a low forward
voltage. Cree’s XT™ chips are tested for conformity to optical and electrical specifications and the ability to withstand
1000 V ESD. Applications for XThin LEDs include next-generation mobile appliances for use in their LCD backlights and
digital camera flash where brightness, sub-miniaturization, and low power consumption are required.
CxxxXT420-Sxx00-A Chip Diagram
Top View
Bottom View
Die Cross Section
G•SiC LED Chip
420 x 420 μm
Gold Bond Pad
105 μm Diameter
SiC Substrate
t = 175 µm
Backside
Metalization
Cathode (-)
Anode (+)


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