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PZTA42 Scheda tecnica(PDF) 3 Page - NXP Semiconductors |
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PZTA42 Scheda tecnica(HTML) 3 Page - NXP Semiconductors |
3 / 8 page 1999 May 21 3 Philips Semiconductors Product specification NPN high-voltage transistor PZTA42 THERMAL CHARACTERISTICS Note 1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”. CHARACTERISTICS Tamb =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 104 K/W Rth j-s thermal resistance from junction to soldering point 23 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ICBO collector cut-off current IE = 0; VCB = 200 V − 20 nA IEBO emitter cut-off current IC = 0; VBE =6V − 100 nA hFE DC current gain VCE =10V IC = 1 mA 25 − IC =10mA 40 − IC =30mA 40 − VCEsat collector-emitter saturation voltage IC = 20 mA; IB =2mA − 500 mV VBEsat base-emitter saturation voltage IC = 20 mA; IB =2mA − 900 mV Cre feedback capacitance IC =ic = 0; VCB = 20 V; f = 1 MHz − 3pF fT transition frequency IC = 10 mA; VCE = 20 V; f = 100 MHz 50 − MHz |
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