PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

5962-9324202Q3A

ACTIVE

LCCC

FK

28

1

TBD

POST-PLATE

N / A for Pkg Type

5962-9324202QKA

ACTIVE

CFP

W

24

1

TBD

A42

N / A for Pkg Type

5962-9324202QLA

ACTIVE

CDIP

JT

24

1

TBD

A42 SNPB

N / A for Pkg Type

SN74ABT652ADBLE

OBSOLETE

SSOP

DB

24

TBD

Call TI

Call TI

SN74ABT652ADBR

ACTIVE

SSOP

DB

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ADBRE4

ACTIVE

SSOP

DB

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ADBRG4

ACTIVE

SSOP

DB

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ADW

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ADWE4

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ADWG4

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ADWR

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ADWRE4

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ADWRG4

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ANSR

ACTIVE

SO

NS

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ANSRE4

ACTIVE

SO

NS

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74ABT652ANSRG4

ACTIVE

SO

NS

24

2000

TBD

Call TI

Call TI

SN74ABT652ANT

ACTIVE

PDIP

NT

24

15

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74ABT652ANTE4

ACTIVE

PDIP

NT

24

15

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SNJ54ABT652AFK

ACTIVE

LCCC

FK

28

1

TBD

POST-PLATE

N / A for Pkg Type

SNJ54ABT652AJT

ACTIVE

CDIP

JT

24

1

TBD

A42 SNPB

N / A for Pkg Type

SNJ54ABT652AW

ACTIVE

CFP

W

24

1

TBD

A42

N / A for Pkg Type

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

PACKAGE OPTION ADDENDUM

www.ti.com

1-Jun-2007

Addendum-Page 1