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TSC2005IYZLR Scheda tecnica(PDF) 2 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation. Click here to check the latest version.
Il numero della parte TSC2005IYZLR
Spiegazioni elettronici  1.6V to 3.6V, 12-Bit, Nanopower, 4-Wire TOUCH SCREEN CONTROLLER with SPI??Interface
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Produttore elettronici  BURR-BROWN [Burr-Brown (TI)]
Homepage  http://www.burr-brown.com
Logo BURR-BROWN - Burr-Brown (TI)

TSC2005IYZLR Scheda tecnica(HTML) 2 Page - Burr-Brown (TI)

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ABSOLUTE MAXIMUM RATINGS
(1)
TSC2005
SBAS379A – DECEMBER 2006 – REVISED MAY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
TYPICAL
TYPICAL
NO MISSING
INTEGRAL
GAIN
CODES
SPECIFIED
TRANSPORT
LINEARITY
ERROR
RESOLUTION
PACKAGE
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
MEDIA,
PRODUCT
(LSB)
(LSB)
(BITS)
TYPE
DESIGNATOR
RANGE
MARKING
NUMBER
QUANTITY
Small Tape
18-Pin,
TSC2005IYZLT
and Reel, 250
5 x 6 Matrix,
TSC2005
±1.5
– 0.2/+4.4
11
YZL
–40
°C to +85°C
TSC2005I
2.5 x 3
Tape and
TSC2005IYZLR
WCSP
Reel, 3000
(1)
For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
Over operating free-air temperature range (unless otherwise noted)
TSC2005
UNIT
Analog input X+, Y+, AUX to SNSGND
–0.4 to SNSVDD + 0.1
V
Analog input X–, Y– to SNSGND
–0.4 to SNSVDD + 0.1
V
SNSVDD to SNSGND
–0.3 to 5
V
Voltage range
SNSVDD to AGND
–0.3 to 5
V
I/OVDD to DGND
–0.3 to 5
V
SNSVDD to I/OVDD
–2.40 to +0.3
V
Digital input voltage to DGND
–0.3 to I/OVDD + 0.3
V
Digital output voltage to DGND
–0.3 to I/OVDD + 0.3
V
Power dissipation
WCSP package
(TJ Max - TA)/θJA
Low-K
113
Thermal impedance,
θ
JA
WCSP package
°C/W
High-K
62
Operating free-air temperature range, TA
–40 to +85
°C
Storage temperature range, TSTG
–65 to +150
°C
Junction temperature, TJ Max
+150
°C
Vapor phase (60 sec)
+215
°C
Lead temperature
Infrared (15 sec)
+220
°C
IEC contact discharge(2)
X+, X–, Y+, Y–
±12
kV
IEC air discharge(2)
X+, X–, Y+, Y–
±25
kV
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
(2)
Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.
2
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