10

FN6380.0

September 29, 2006

ISL54058

Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)

6

B

E

A

D

0.10 C

2X

C

0.05 C

A

0.10 C

A1

SEATING PLANE

INDEX AREA

2

1

N

TOP VIEW

BOTTOM VIEW

SIDE VIEW

NX (b)

SECTION "C-C"

e

CC

5

C

L

TERMINAL TIP

(A1)

L

0.10 C

2X

e

L1

NX L

2

1

0.10 M C A B

0.05 M C

5

NX b

(DATUM B)

(DATUM A)

PIN #1 ID

16X

3.00

1.40

2.20

0.40

0.50

0.20

0.40

0.20

0.90

1.40

1.80

LAND PATTERN

10

L16.2.6x1.8A

16 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

0.45

0.50

0.55

-

A1

-

-

0.05

-

A3

0.127 REF

-

b

0.15

0.20

0.25

5

D

2.55

2.60

2.65

-

E

1.75

1.80

1.85

-

e

0.40 BSC

-

L

0.35

0.40

0.45

-

L1

0.45

0.50

0.55

-

N16

2

Nd

4

3

Ne

4

3

θ

0-

12

4

Rev. 4 8/06

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd and Ne refer to the number of terminals on D and E side,

respectively.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Maximum package warpage is 0.05mm.

8. Maximum allowable burrs is 0.076mm in all directions.

9. JEDEC Reference MO-255.

10. For additional information, to assist with the PCB Land Pattern

Design effort, see Intersil Technical Brief TB389.