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ISL24003IRZ Scheda tecnica(PDF) 9 Page - Intersil Corporation |
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ISL24003IRZ Scheda tecnica(HTML) 9 Page - Intersil Corporation |
9 / 10 page 9 FN6118.0 December 7, 2005 Power Supply Bypassing and Printed Circuit Board Layout As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended, lead lengths should be as short as possible, and the power supply pins must be well bypassed to reduce the risk of oscillation. For normal single supply operation, where the VS- pin is connected to ground, one 0.1µF ceramic capacitor should be placed from the VS+ pin to ground. A 4.7µF tantalum capacitor should then be connected from the VS+ pin to ground. One 4.7µF capacitor may be used for multiple devices. This same capacitor combination should be placed at each supply pin to ground if split supplies are to be used. Important Note: The metal plane used for heat sinking of the device is electrically connected to the negative supply potential (VS-). If VS- is tied to ground, the thermal pad can be connected to ground. Otherwise, the thermal pad must be isolated from any other power planes. ISL24003 |
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