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ISL43143 Scheda tecnica(PDF) 4 Page - Intersil Corporation |
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ISL43143 Scheda tecnica(HTML) 4 Page - Intersil Corporation |
4 / 15 page 4 FN6037.3 December 1, 2005 Absolute Maximum Ratings Thermal Information V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15 to 0.3V All Other Pins (Note 3) . . . . . . . . . . . . . .((V-) - 0.3V) to ((V+) + 0.3V) Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA Peak Current, IN, NO, NC, or COM (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 100mA ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV Operating Conditions Temperature Range ISL4314XIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C Thermal Resistance (Typical) θJA (°C/W) 16 Ld TSSOP Package (Note 4) . . . . . . . . . . . . . . . 150 16 Ld QFN Package (Note 5) . . . . . . . . . . . . . . . . . . 75 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C Moisture Sensitivity (See Technical Brief TB363) All Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1 Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C (TSSOP - Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. Signals on NC, NO, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward diode current to maximum current ratings. 4. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379 and Tech Brief TB389. Electrical Specifications: ±5V Supply Test Conditions: V SUPPLY = ±4.5V to ±5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 5), Unless Otherwise Specified PARAMETER TEST CONDITIONS TEMP (°C) (NOTE 6) MIN TYP (NOTE 6) MAX UNITS ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG Full V- - V+ V ON Resistance, RON VS = ±4.5V, ICOM = 10mA, VNO or VNC = ±3.5V, See Figure 5 25 - 18 25 Ω Full - - 30 Ω RON Matching Between Channels, ∆R ON VS = ±4.5V, ICOM = 10mA, VNO or VNC = ±3V 25 - 0.5 2 Ω Full - - 4 Ω RON Flatness, RFLAT(ON) VS = ±4.5V, ICOM = 10mA, VNO or VNC = 0V, ±3V, Note 8 25 - - 5 Ω Full - - 5 Ω NO or NC OFF Leakage Current, INO(OFF) or INC(OFF) VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V, Note 7 25 -0.1 - 0.1 nA Full -2.5 - 2.5 nA COM OFF Leakage Current, ICOM(OFF) VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V, Note 7 25 -0.1 - 0.1 nA Full -2.5 - 2.5 nA COM ON Leakage Current, ICOM(ON) VS = ±5.5V, VCOM = VNO or VNC = ±4.5V, Note 7 25 -0.2 - 0.2 nA Full -5 - 5 nA DIGITAL INPUT CHARACTERISTICS Input Voltage High, VINH Full 2.4 1.6 - V Input Voltage Low, VINL Full - 1.5 0.8 V Input Current, IINH, IINL VS = ±5.5V, VIN = 0V or V+ Full -1 - 1 µA DYNAMIC CHARACTERISTICS Turn-ON Time, tON VS = ±4.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, See Figure 1 25 - 52 65 ns Full - - 75 ns Turn-OFF Time, tOFF VS = ±4.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, See Figure 1 25 - 40 50 ns Full - - 55 ns Break-Before-Make Time Delay (ISL43145 only), tD VS = ±5.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, See Figure 3 Full 5 19 - ns Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0Ω, See Figure 2 25 - - 5 pC NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7 25 - 10 - pF ISL43143, ISL43144, ISL43145 |
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