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AM29LV320MB110REI Scheda tecnica(PDF) 6 Page - SPANSION

Il numero della parte AM29LV320MB110REI
Spiegazioni elettronici  32 Megabit (2 M x 16-Bit/4 M x 8-Bit) MirrorBit??3.0 Volt-only Boot Sector Flash Memory
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Am29LV320MT/B
26518C3 January 31, 2007
D A TA
SH EE T
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 11
Table 1. Device Bus Operations .....................................................11
Requirements for Reading Array Data ................................... 11
Writing Commands/Command Sequences ............................ 12
Automatic Sleep Mode ........................................................... 13
RESET#: Hardware Reset Pin ............................................... 13
Output Disable Mode .............................................................. 13
Table 2. Am29LV320MT Top Boot Sector Architecture ..................13
Table 3. Am29LV320MB Bottom Boot Sector Architecture .............15
Table 4. Autoselect Codes, (High Voltage Method) .......................17
Sector Group Protection and Unprotection ............................. 18
Table 5. Am29LV320MT Top Boot Sector Protection .....................18
Table 6. Am29LV320MB Bottom Boot Sector Protection ................18
Write Protect (WP#) ................................................................ 18
Temporary Sector Group Unprotect ....................................... 19
Figure 1. Temporary Sector Group Unprotect Operation................ 19
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 20
Secured Silicon Sector Flash Memory Region ....................... 21
Table 7. Secured Silicon Sector Contents ......................................21
Figure 3. Secured Silicon Sector Protect Verify .............................. 22
Hardware Data Protection ...................................................... 22
Common Flash Memory Interface (CFI) . . . . . . . 22
Command Definitions . . . . . . . . . . . . . . . . . . . . . 25
Reading Array Data ................................................................ 25
Reset Command ..................................................................... 26
Autoselect Command Sequence ............................................ 26
Enter Secured Silicon Sector/Exit Secured Silicon Sector
Command Sequence .............................................................. 26
Word/Byte Program Command Sequence ............................. 27
Figure 4. Write Buffer Programming Operation............................... 29
Figure 5. Program Operation .......................................................... 30
Program Suspend/Program Resume Command Sequence ... 30
Figure 6. Program Suspend/Program Resume............................... 31
Chip Erase Command Sequence ........................................... 31
Sector Erase Command Sequence ........................................ 31
Figure 7. Erase Operation............................................................... 32
Erase Suspend/Erase Resume Commands ........................... 32
Write Operation Status . . . . . . . . . . . . . . . . . . . . 35
DQ7: Data# Polling ................................................................. 35
Figure 8. Data# Polling Algorithm ................................................... 35
DQ6: Toggle Bit I .................................................................... 36
Figure 9. Toggle Bit Algorithm......................................................... 37
DQ2: Toggle Bit II ................................................................... 37
Reading Toggle Bits DQ6/DQ2 ............................................... 37
DQ5: Exceeded Timing Limits ................................................ 38
DQ3: Sector Erase Timer ....................................................... 38
DQ1: Write-to-Buffer Abort ..................................................... 38
Table 14. Write Operation Status ................................................... 38
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 39
Figure 10. Maximum Negative Overshoot Waveform ................... 39
Figure 11. Maximum Positive Overshoot Waveform..................... 39
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 40
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 12. Test Setup.................................................................... 41
Table 15. Test Specifications ......................................................... 41
Key to Switching Waveforms. . . . . . . . . . . . . . . . 41
Figure 13. Input Waveforms and
Measurement Levels...................................................................... 41
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 42
Read-Only Operations ........................................................... 42
Figure 14. Read Operation Timings ............................................... 42
Figure 15. Page Read Timings ...................................................... 43
Hardware Reset (RESET#) .................................................... 44
Figure 16. Reset Timings ............................................................... 44
Erase and Program Operations .............................................. 45
Figure 17. Program Operation Timings.......................................... 46
Figure 18. Accelerated Program Timing Diagram.......................... 46
Figure 19. Chip/Sector Erase Operation Timings .......................... 47
Figure 20. Data# Polling Timings (During Embedded Algorithms). 48
Figure 21. Toggle Bit Timings (During Embedded Algorithms)...... 49
Figure 22. DQ2 vs. DQ6................................................................. 49
Temporary Sector Unprotect .................................................. 50
Figure 23. Temporary Sector Group Unprotect Timing Diagram ... 50
Figure 24. Sector Group Protect and Unprotect Timing Diagram .. 51
Alternate CE# Controlled Erase and Program Operations ..... 52
Figure 25. Alternate CE# Controlled Write (Erase/Program)
Operation Timings.......................................................................... 53
Erase And Programming Performance. . . . . . . . 54
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 54
TSOP Pin and BGA Package Capacitance . . . . . 55
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 56
TS 048—48-Pin Standard Pinout Thin Small Outline Package
(TSOP) ................................................................................... 56
FBC048—48-Ball Fine-pitch Ball Grid Array (BGA)
9 x 8 mm Package .................................................................. 57
LAA064—64-Ball Fortified Ball Grid Array (BGA)
13 x 11 mm Package .............................................................. 58
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 59


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