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L640MB10RI Scheda tecnica(PDF) 10 Page - Advanced Micro Devices |
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L640MB10RI Scheda tecnica(HTML) 10 Page - Advanced Micro Devices |
10 / 66 page 8 Am29LV640MT/B 26190C8 February 1, 2007 D A TA SH EE T CONNECTION DIAGRAMS Special Package Handling Instructions Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The package and/or data integrity can be compromised if the package body is exposed to temperatures above 150 °C for prolonged periods of time. B3 C3 D3 E3 F3 G3 H3 B4 C4 D4 E4 F4 G4 H4 B5 C5 D5 E5 F5 G5 H5 B6 C6 D6 E6 F6 G6 H6 B7 C7 D7 E7 F7 G7 H7 B8 C8 D8 E8 F8 G8 H8 NC NC NC VSS NC NC NC VSS DQ15/A-1 BYTE# A16 A15 A14 A12 DQ6 DQ13 DQ14 DQ7 A11 A10 A8 DQ4 VCC DQ12 DQ5 A19 A21 RESET# DQ3 DQ11 DQ10 DQ2 A20 A18 WP#/ACC DQ1 DQ9 DQ8 DQ0 A5 A6 A17 A3 A4 A5 A6 A7 A8 NC A13 A9 WE# RY/BY# A7 B2 C2 D2 E2 F2 G2 H2 VSS OE# CE# A0 A1 A2 A4 A2 A3 B1 C1 D1 E1 F1 G1 H1 NC NC NC NC NC NC NC A1 NC 64-Ball Fortified BGA ( fBGA) Top View, Balls Facing Down |
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