FMA3014 datasheet(6/6 Pages) FILTRONIC

Il numero della parte	FMA3014

Spiegazioni elettronici	12.7-16GHZ MMIC LIMITING AMPLIFIER

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Produttore elettronici	FILTRONIC [Filtronic Compound Semiconductors]

Homepage	http://www.filtronic.co.uk/

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Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Tel: +44 (0) 1325 301111

Fax: +44 (0) 1325 306177

Email: sales@filcs.com

Website: www.filtronic.com

6

Preliminary Datasheet v2.1

FMA3014

PREFERRED ASSEMBLY INSTRUCTIONS:

GaAs devices are fragile and should be

handled with great care. Specially designed

collets should be used where possible.

The

recommended

die

attach

is

gold/tin

eutectic solder under a nitrogen atmosphere.

Stage

temperature

should

be

280-290

°C;

maximum time at temperature is one minute.

The

recommended

wire

bond

method

is

thermo-compression wedge bonding with 0.7

or 1.0 mil (0.018 or 0.025 mm) gold wire.

Stage temperature should be 250-260

°C.

Bonds should be made from the die first and

then to the mounting substrate or package.

The physical length of the bondwires should be

minimised especially when making RF or

ground connections.

HANDLING

PRECAUTIONS:

To avoid damage to the devices care should

be

exercised

during

handling.

Proper

Electrostatic

Discharge

(ESD)

precautions

should be observed at all stages of storage,

handling,

assembly,

and

testing.

These

devices should be treated as Class 1A (0-500

V) as defined in JEDEC Standard No. 22-

A114.

Further information on ESD control

measures can be found in MIL-STD-1686 and

MIL-HDBK-263.

APPLICATION NOTES & DESIGN DATA:

Application Notes and design data including S-

parameters,

noise

data

and

large-signal

models are available on request.

DISCLAIMERS:

This product is not designed for use in any

space

based

or

life

sustaining/supporting

equipment.

ORDERING INFORMATION:

PART NUMBER

DESCRIPTION

FMA3014

Die in Waffle-pack

(Gel-pak available on request)

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