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AD8051 Scheda tecnica(PDF) 9 Page - Analog Devices |
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AD8051 Scheda tecnica(HTML) 9 Page - Analog Devices |
9 / 24 page AD8051/AD8052/AD8054 Rev. G | Page 9 of 24 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Ratings Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Supply Voltage 12.6 V Internal Power Dissipation1 SOIC Packages Observe Power Derating Curves SOT-23 Package Observe Power Derating Curves MSOP Package Observe Power Derating Curves MAXIMUM POWER DISSIPATION TSSOP Package Observe Power Derating Curves The maximum power that can be safely dissipated by the AD8051/AD8052/AD8054 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit can cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. Input Voltage (Common Mode) ±VS Differential Input Voltage ±2.5 V Output Short-Circuit Duration Observe Power Derating Curves Storage Temperature Range (R) −65°C to +150°C Operating Temperature Range (A Grade) −40°C to +125°C Lead Temperature (Soldering 10 sec) 300°C 1 Specification is for device in free air: 8-Lead SOIC: θ = 125°C/W 5-Lead SOT-23: θ = 180°C/W 8-Lead MSOP: θ = 150°C/W 14-Lead SOIC: θ = 90°C/W 14-Lead TSSOP: θ = 120°C/W. While the AD8051/AD8052/AD8054 are internally short- circuit protected, this cannot be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves. JA JA JA JA JA AMBIENT TEMPERATURE (°C) –55 0 2.0 1.5 1.0 0.5 5 2.5 MSOP-8 SOIC-8 SOT-23-5 SOIC-14 TSSOP-14 –35 –15 15 35 55 75 95 115 Figure 6. Maximum Power Dissipation vs. Temperature for AD8051/AD8052/AD8054 ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
Codice articolo simile - AD8051_06 |
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Descrizione simile - AD8051_06 |
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