MC10EP57, MC100EP57

http://onsemi.com

7

−40°C

25°C

85°C

Symbol

Characteristic

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

Maximum Frequency (Figure 2)

> 3

> 3

> 3

GHz

Propagation Delay to

Output Differential

D to Q, Q

COM_SEL, SEL to Q, Q

250

300

350

400

450

500

275

320

375

420

475

520

320

320

420

450

520

575

ps

Device to Device Skew (Note 21)

200

200

200

ps

CLOCK Random Jitter (RMS)

@ v0.5 GHz

@ v1.0 GHz

@ v1.5 GHz

@ v2.0 GHz

@ v2.5 GHz

@ v3.0 GHz

0.122

0.110

0.112

0.128

0.114

0.116

0.3

0.3

0.3

0.3

0.3

0.3

0.140

0.135

0.132

0.139

0.129

0.152

0.3

0.3

0.3

0.3

0.3

0.3

0.172

0.151

0.152

0.163

0.177

0.305

0.3

0.3

0.3

0.3

0.3

1.0

ps

Input Voltage Swing (Differential Con-

figuration)

150

800

1200

150

800

1200

150

800

1200

mV

Output Rise/Fall Times

Q, Q

(20% − 80%)

70

120

170

70

140

200

70

150

220

ps

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

21.Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays

are measured from the cross point of the inputs to the cross point of the outputs.

0

100

200

300

400

500

600

700

800

900

1000

0

1000

2000

3000

4000

FREQUENCY (MHz)