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MC100EP56DW Scheda tecnica(PDF) 3 Page - ON Semiconductor |
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MC100EP56DW Scheda tecnica(HTML) 3 Page - ON Semiconductor |
3 / 11 page MC10EP56, MC100EP56 http://onsemi.com 3 Table 3. ATTRIBUTES Characteristics Value Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model Charged Device Model > 2 kV > 150 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb−Free Pk SOIC TSSOP QFN Level 1 Level 1 N/A Level 3 Level 3 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 140 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V VI VCC VI VEE 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 20 TSSOP 20 TSSOP 140 100 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 20 TSSOP 23 to 41 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 20 SOIC 20 SOIC 90 60 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 20 SOIC 33 to 35 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm QFN−20 QFN−20 47 33 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board QFN−20 18 °C/W Tsol Wave Solder Pb Pb−Free <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
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