CS5201−1

http://onsemi.com

7

the result can be substituted in Equation (1).

based on an average die size. For a high current regulator

such as the CS5201−1 the majority of the heat is generated

package type, Heatsink interface (is an insulator and thermal

grease used?), and the contact area between the Heatsink and

the package. Once these calculations are complete, the

the proper Heatsink selected. For further discussion on

Heatsink selection, see application note “Thermal

Management,” document number AND8036/D, available

through the Literature Distribution Center or via our website

at http://onsemi.com.

ORDERING INFORMATION

Device

Type*

Package

CS5201−1GT3

1.0 A, Adj. Output

TO−220−3, STRAIGHT

50 Units / Rail

CS5201−1GDP3

1.0 A, Adj. Output

50 Units / Rail

CS5201−1GDPR3

1.0 A, Adj. Output

750 / Tape & Reel

CS5201−1GST3

1.0 A, Adj. Output

SOT−223

80 Units / Rail

CS5201−1GSTR3

1.0 A, Adj. Output

SOT−223

2500 / Tape & Reel

CS5201−1GSTR3G

1.0 A, Adj. Output

SOT−223

(Pb−Free)

2500 / Tape & Reel

*Consult your local sales representative for fixed output voltage versions.

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MARKING DIAGRAMS

5201−1

AWLYWW

1

ALYW

201−1

1

5201−1

AWLYWW

1

DP SUFFIX

CASE 418AB

SOT−223

ST SUFFIX

CASE 318E

TO−220−3

T SUFFIX

CASE 221A

A

= Assembly Location

WL, L

= Wafer Lot

YY, Y

= Year

WW, W = Work Week

CS

CS

PACKAGE THERMAL DATA

Parameter

TO−220−3

SOT−223

Unit

Typical

3.5

3.5

15

°C/W

Typical

50

10−50*

156

°C/W