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2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

INN

INP

GAIN0

GAIN1

SHUTDOWN

PGND

VCLAMP

BSN

OUTN

OUTN

PGND

VREF

BYPASS

COSC

ROSC

AGND

AGND

BSP

OUTP

OUTP

PGND

PWP PACKAGE

(TOP VIEW)

TPA3001D1

SLOS398C – DECEMBER 2002 – REVISED JULY 2006

PACKAGED DEVICES

–40

°C to 85°C

TPA3001D1PWP

(1)

For the most current package and ordering information, see the

Package Option Addendum at the end of this document, or see the

TI website at www.ti.com.

(2)

The PWP package is available taped and reeled. To order a taped

and reeled part, add the suffix R to the part number (e.g.,

TPA3001D1PWPR).

Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

NO.

AGND

18, 19

Analog ground terminal

Bootstrap terminal for high-side gate drive of negative BTL output (connect a 0.22-

µF capacitor

BSN

8

I

with a 51-

Ω resistor in series from OUTN to BSN)

Bootstrap terminal for high-side gate drive of positive BTL output (connect a 0.22-

µF capacitor

BSP

17

I

with a 51-

Ω resistor in series from OUTP to BSP)

BYPASS

22

I

Connect 1-

µF capacitor to ground for BYPASS voltage filtering

COSC

21

I

Connect a 220-pF capacitor to ground to set oscillation frequency

GAIN0

3

I

Bit 0 of gain control (see Table 1 for gain settings)

GAIN1

4

I

Bit 1 of gain control (see Table 1 for gain settings)

INN

1

I

Negative differential input

INP

2

I

Positive differential input

OUTN

10, 11

O

Negative BTL output, connect Schottky diode from PGND to OUTN for short-circuit protection

OUTP

14, 15

O

Positive BTL output, connect Schottky diode from PGND to OUTP for short-circuit protection

PGND

6, 12, 13

Power ground

9, 16

I

High-voltage power supply (for output stages)

ROSC

20

I

Connect 120 k

Ω resistor to ground to set oscillation frequency

SHUTDOWN

5

I

Shutdown terminal (negative logic), TTL compatible, 21-V compliant

24

I

Analog high-voltage power supply

VCLAMP

7

O

Connect 1-

µF capacitor to ground to provide reference voltage for H-bridge gates

VREF

23

O

5-V internal regulator for control circuitry (connect a 0.1-

µF to 1-µF capacitor to ground)

Connect to AGND and PGND - should be star point for both grounds. Internal resistive connection

to AGND. Thermal vias on the PCB should connect this pad to a large copper area on an internal

Thermal Pad

-

-

or bottom layer for the best thermal performance. The PAD must be soldered to the PCB for

mechanical reliability.

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