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BU4540 Scheda tecnica(PDF) 1 Page - NXP Semiconductors |
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BU4540 Scheda tecnica(HTML) 1 Page - NXP Semiconductors |
1 / 4 page Philips Semiconductors Objective specification Silicon Diffused Power Transistor BU4540AL GENERAL DESCRIPTION Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full pack envelope intended for use in horizontal deflection circuits of colour television receivers and p.c monitors. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT V CESM Collector-emitter voltage peak value V BE = 0 - 1500 V V CEO Collector-emitter voltage (open base) - 800 V I C Collector current (DC) - 25 A I CM Collector current peak value - 40 A P tot Total power dissipation T mb ≤ 25 ˚C - 125 W V CEsat Collector-emitter saturation voltage I C = 16.0 A; IB = 4 A - 3.0 V I Csat Collector saturation current f = 32kHz 16 - A f = 110kHz 8 - A t f Storage time I Csat = 16 A; f = 32kHz t.b.f t.b.f µs I Csat = 8 A; f = 110kHz t.b.f t.b.f µs PINNING - SOT430 PIN CONFIGURATION SYMBOL PIN DESCRIPTION 1 base 2 collector 3 emitter heat collector sink LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V CESM Collector-emitter voltage peak value V BE = 0 V - 1500 V V CEO Collector-emitter voltage (open base) - 800 V I C Collector current (DC) - 25 A I CM Collector current peak value - 40 A I B Base current (DC) - 10 A I BM Base current peak value - 15 A -I B(AV) Reverse base current average over any 20 ms period - 200 mA P tot Total power dissipation T mb ≤ 25 ˚C - 125 W T stg Storage temperature -55 150 ˚C T j Junction temperature - 150 ˚C THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT R th j-mb Junction to mounting base - - 1.0 K/W R th j-a Junction to ambient in free air 35 - K/W 12 3 b c e January 1998 1 Rev 1.000 |
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