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SN74GTLPH16927VR Scheda tecnica(PDF) 11 Page - Texas Instruments |
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SN74GTLPH16927VR Scheda tecnica(HTML) 11 Page - Texas Instruments |
11 / 19 page SN74GTLPH16927 18-BIT LVTTL-TO-GTLP BUS TRANSCEIVER WITH SOURCE-SYNCHRONOUS CLOCK OUTPUTS SCES413 – OCTOBER 2002 11 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 skew characteristics over recommended ranges of supply voltage and operating free-air temperature, VREF = 1 V (unless otherwise noted); standard lumped loads, CL = 30 pF for B port (see Figure 1)† PARAMETER FROM (INPUT) TO (OUTPUT) FSTA TEST CONDITIONS MIN MAX UNIT tsk(LH)‡ SYSCLK B 0.5 ns tsk(HL)‡ SYSCLK B 0.5 ns ‡ SSCLK → B VCC = 3.15 V, T = 85°C 3.4 4.7 tsk(LH)‡ SYSCLK SSCLK → Bn (see Figure 2) GND VCC = 3.3 V, T = 25°C 3.2 4.5 ns (see Figure 2) VCC = 3.45 V, T = –40°C 3.1 4.4 ‡ SSCLK → B VCC = 3.15 V, T = 85°C 3.2 4.6 tsk(HL)‡ SYSCLK SSCLK → Bn (see Figure 2) GND VCC = 3.3 V, T = 25°C 2.8 4.1 ns (see Figure 2) VCC = 3.45 V, T = –40°C 2.4 3.7 ‡ SSCLK → B VCC = 3.15 V, T = 85°C 7.1 8.9 tsk(LH)‡ SYSCLK SSCLK → Bn (see Figure 2) VCC VCC = 3.3 V, T = 25°C 6.6 8.4 ns (see Figure 2) VCC = 3.45 V, T = –40°C 6.3 8 ‡ SSCLK → B VCC = 3.15 V, T = 85°C 7.2 9 tsk(HL)‡ SYSCLK SSCLK → Bn (see Figure 2) VCC VCC = 3.3 V, T = 25°C 6.5 8.2 ns (see Figure 2) VCC = 3.45 V, T = –40°C 6 7.6 tsk(t)‡ SYSCLK B 1.3 ns tsk(prLH)§ SYSCLK B 1.8 ns tsk(prHL)§ SYSCLK B 2.8 ns † Actual skew values between the GTLP outputs could vary on the backplane due to the loading and impedance seen by the device. ‡ tsk(LH)/tsk(HL) and tsk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs with the same packaged device. The specifications are given for specific worst-case VCC and temperature. The specifications apply to any outputs switching in the same direction, either high to low [tsk(HL)], low to high [tsk(LH)], or in opposite directions, both low to high and high to low [tsk(t)]. § tsk(prLH) or tsk(prHL) – Part-to-part skew is designed as the absolute value of the difference between the actual propagation delay for all outputs from device to device. The parameter is specified for a specific worst-case VCC and temperature. Furthermore, these values are provided by TI SPICE simulations. |
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