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TDA3755 Scheda tecnica(PDF) 11 Page - NXP Semiconductors |
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TDA3755 Scheda tecnica(HTML) 11 Page - NXP Semiconductors |
11 / 12 page June 1986 11 Philips Semiconductors Product specification PAL/NTSC/SECAM synchronization processor for video recorders TDA3755 PACKAGE OUTLINE REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT102-1 93-10-14 95-01-23 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 3.9 3.4 0.254 2.54 7.62 8.25 7.80 9.5 8.3 0.85 4.7 0.51 3.7 inches 0.055 0.044 0.021 0.015 0.013 0.009 1.40 1.14 0.055 0.044 0.86 0.84 0.26 0.24 0.15 0.13 0.01 0.10 0.30 0.32 0.31 0.37 0.33 0.033 0.19 0.020 0.15 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 18 1 10 9 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 |
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