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KMI15-4 Scheda tecnica(PDF) 11 Page - NXP Semiconductors |
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KMI15-4 Scheda tecnica(HTML) 11 Page - NXP Semiconductors |
11 / 16 page 2000 Sep 05 11 Philips Semiconductors Product specification Rotational speed sensor KMI15/4 PACKAGE OUTLINE UNIT bp c Q L2 L1 v REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 1.7 1.4 0.8 0.7 bp1 1.57 1.47 5.7 5.5 4.1 3.9 0.3 0.24 1.2 0.9 3.9 3.5 L3 6.55 6.35 M1 5.65 5.35 M2 5.65 5.35 M3 (1) 3.15 2.85 L 7.55 7.25 D(2) D1 (2) 3.15 2.95 D2 (2) 4.5 4.3 E(2) 5.7 5.5 4.6 4.4 E1 (2) 18.2 17.8 HE 5.6 5.5 HE1 K max. 3.87 e 0.25 0.75 0.65 DIMENSIONS (mm are the original dimensions) SOT453C 99-09-23 00-08-31 0 2.5 5 mm scale A(1) Plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads SOT453C e E E1 HE1 L1 D L bp1 D1 D2 L3 HE M1 Notes 1. Glue thickness not included. 2. Plastic or metal protrusions of 0.15 mm maximum per side are not included. L2 bp c 12 v M AB v M AB Q A K M2 M3 B A SENSOR DIE POSITION * centre of reading point |
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Descrizione simile - KMI15-4 |
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