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NCP9002 Scheda tecnica(PDF) 1 Page - ON Semiconductor |
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NCP9002 Scheda tecnica(HTML) 1 Page - ON Semiconductor |
1 / 13 page © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 4 1 Publication Order Number: NCP9002/D NCP9002 1.3 Watt Audio Power Amplifier with Fast Turn On Time The NCP9002 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP9002 is capable of delivering 1.3 W of continuous average power to an 8.0 W BTL load from a 5.0 V power supply, and 1.0 W to a 4.0 W BTL load from a 3.6 V power supply. The NCP9002 provides high quality audio while requiring few external components and minimal power consumption. It features a low−power consumption shutdown mode, which is achieved by driving the SHUTDOWN pin with logic low. The NCP9002 contains circuitry to prevent from “pop and click” noise that would otherwise occur during turn−on and turn−off transitions. For maximum flexibility, the NCP9002 provides an externally controlled gain (with resistors), as well as an externally controlled turn−on time (with the bypass capacitor). When using a 1 mF bypass capacitor, it offers 100 ms wake up time. Due to its excellent PSRR, it can be directly connected to the battery, saving the use of an LDO. This device is available in a 9−Pin Flip−Chip CSP (Lead−Free). Features • 1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply • Excellent PSRR: Direct Connection to the Battery • “Pop and Click” Noise Protection Circuit • Ultra Low Current Shutdown Mode: 10 nA • 2.2 V−5.5 V Operation • External Gain Configuration Capability • External Turn−on Time Configuration Capability: 100 ms (1 mF Bypass Capacitor) • Up to 1.0 nF Capacitive Load Driving Capability • Thermal Overload Protection Circuitry • This is a Pb−Free Device Typical Applications • Portable Electronic Devices • PDAs • Wireless Phones 9−Pin Flip−Chip CSP FC SUFFIX CASE 499AL PIN CONNECTIONS MAZ = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package MARKING DIAGRAMS A3 B3 C3 A2 B2 C2 A1 B1 C1 INM OUTA INP VM_P VM Vp BYPASS OUTB SHUTDOWN 9−Pin Flip−Chip CSP (Top View) A1 See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. ORDERING INFORMATION MAZ G AYWW A1 A3 C1 http://onsemi.com |
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