MC10ELT20, MC100ELT20

http://onsemi.com

2

5

6

7

8

D

NC

PECL

TTL

Figure 1. 8−Lead Pinout (Top View)

and Logic Diagram

NC 4

3

2

1

GND

Q

Q

NC

Table 1. PIN DESCRIPTION

Pin

Function

Q, Q

PECL Differential Outputs*

D

TTL Input

Positive Supply

GND

Ground

NC

No Connect

EP

Exposed pad must be connected to a sufficient

thermal conduit. Electrically connect to the most

negative supply or leave floating open.

*Output state undetermined when inputs are open.

Table 2. ATTRIBUTES

Characteristics

Value

Internal Input Pulldown Resistor

N/A

Internal Input Pullup Resistor

N/A

ESD Protection

Human Body Model

Machine Model

> 4 kV

> 200 V

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Pb Pkg

Pb−Free Pkg

SO−8

TSSOP−8

DFN8

Level 1

Level 1

Level 1

Level 1

Level 3

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

51 Devices

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

Positive Power Supply

GND = 0 V

7

V

Input Voltage

GND = 0 V

7

V

Output Current

Continuous

Surge

50

100

mA

mA

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

SO−8

SO−8

190

130

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

SO−8

41 to 44

°C/W

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

TSSOP−8

TSSOP−8

185

140

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

TSSOP−8

41 to 44

°C/W

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

DFN8

DFN8

129

84

°C/W

°C/W

Wave Solder

Pb

Pb−Free

< 3 s @ 248°C

< 3 s @ 260°C

265

265

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.