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AM6012 Scheda tecnica(PDF) 4 Page - NXP Semiconductors

Il numero della parte AM6012
Spiegazioni elettronici  12-Bit multiplying D/A converter
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Produttore elettronici  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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AM6012 Scheda tecnica(HTML) 4 Page - NXP Semiconductors

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Philips Semiconductors Linear Products
Product specification
AM6012
12-Bit multiplying D/A converter
August 31, 1994
779
CIRCUIT DESCRIPTION
The AM6012 is a 12-bit DAC which uses diffused resistors and
requires no trimming to guarantee monotonicity over the
temperature range. A segmented DAC design guarantees a more
uniform step size over the temperature range than is normally
available with trimmed 12-bit converters. The converter features
differential high compliance current outputs, wide supply range, and
a multiplying reference input.
In many converter applications, uniform step size is more important
than conformance to an ideal straight line. Many 12-bit converters
are used for high resolution rather than high linearity, since few
transducers are more linear than
±0.1%. All classic binarily weighted
converters require
±1/2LSB (±0.012%) linearity in order to guarantee
monotonicity, which requires very tight resistor matching and
tracking. The AM6012 uses conventional bipolar processing to
achieve high differential linearity and monotonicity without requiring
correspondingly high linearity, or conformance to an ideal straight
line.
One design approach which provides monotonicity without requiring
high linearity is the MOS switch-resistor string. This circuit is actually
a full complement to a current-switched R-2R DAC since it is slower,
has a voltage output, and, if implemented at the 12-bit level, would
use 4096 low tolerance resistors rather than a minimum number of
high tolerance resistors as in the R-2R network. Its lack of speed
and density for 12 bits are its drawbacks.
With the segmented DAC approach, the 4096 required output levels
are composed of 8 groups of 512 steps each. Each step group is
generated by a 9-bit DAC, and each of the segment slopes is
determined by one of 8 equal current sources. The resistors which
determine monotonicity are in the 9-bit DAC. The major carry of the
9-bit DAC is repeated in each of the 8 segments, and requires eight
times lower initial resistor accuracy and tracking to maintain a given
differential nonlinearity over temperature.
The operation of the segmented DAC may be visualized by
assuming an input code of all zeroes. The first segment current IO is
divided into 512 levels by the 9-bit multiplying DAC and fed to the
output, IOUT. As the input code increases, a new segment current is
selected for each 512 counts. The previous segment is fed to output
IOUT where the new step group is added to it, thus ensuring
monotonicity independent of segment resistor values. All higher
order segments feed IOUT.
With the segmented DAC approach, the precision of the 8 main
resistors determines linearity only. The influence of each of these
resistors on linearity is four times lower than that of the MSB resistor
in an R-2R DAC. Hence, assuming the same resistor tolerances for
both, the linearity of the segmented approach would actually be
higher than that of an R-2R design.
The step generator or 9-bit DAC is composed of a master and a
slave ladder. The slave ladder generates the four least significant
bits from the remainder of the master ladder by active current
splitting utilizing scaled emitters. This saves ladder resistors and
greatly reduces the range of emitter scaling required in the 9-bit
DAC. All current switches in the step generator are high-speed
fully-differential switches which are capable of switching low currents
at high speed. This allows the use of a binary scaled network all the
way to the least significant bit which saves power and simplifies the
circuitry.
Diffused resistors have advantages over thin film resistors beyond
simple economy and bipolar process compatibility. The resistors are
fabricated in single crystal rather than amorphous material which
gives them better long term stability and tracking and much higher
moisture resistance. They are diffused at 1000
°C and so are
resistant to changes in value due to thermal and chemical causes.
Also, no burn-in is required for stability. The contact resistance
between aluminum and silicon is more predictable than between
aluminum and an amorphous thin film, and no sandwich metals are
required to enhance or protect the contact or limit alloying. The initial
match between two diffused resistors is similar to that of thin film
since both are defined by photomasks and chemical etching. Since
the resistors are not trimmed or altered after fabrication, their
tracking and long-term characteristics are not degraded.
DIFFERENTIAL VS INTEGRAL NONLINEARITY
Integral nonlinearity, for the purposes of the discussion, refers to the
“straightness” of the line drawn through the individual response
points of a data converter. Differential nonlinearity, on the other
hand, refers to the deviation of the spacing of the adjacent points
from a 1 LSB ideal spacing. Both may be expressed as either a
percentage of full-scale output or as fractional LSBs or both. The
graphs in Figure 1 define the manner in which these parameters are
specified. The left graph shows a portion of the transfer curve of a
DAC with 1/2LSB INL and the (implied) DNL spec of 1 LSB. Below
this is a graphic representation of the way this would appear on a
CRT screen where the AM6012 is used as a display driver. On the
right is a portion of the transfer curve of a DAC specified for 1/2LSB
INL with LSB DNL specified and the graphic display below it.
One of the characteristics of an R-2R DAC in standard form is that
any transition which causes a zero LSB change (i.e., the same
output for two different codes) will exhibit the same output each time
that transition occurs. The same holds true for transitions causing a
2 LSB change. These two problem transitions are allowable for the
standard definition of monotonicity and also allow the device to be
specified very tightly for INL. The major problem arising from this
error type is in A/D converter implementations. Inputs producing the
same output are now represented by ambiguous output codes for an
identical input. Also, two LSB gaps can cause large errors at those
input levels (assuming 1/2LSB quantizing levels). It can be seen
from the two figures that the DNL-specified D/A converter will yield
much finer grained data than the INL-specified part, thus improving
the ability of the A/D to resolve changes in the analog input.


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