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FMM5826X Scheda tecnica(PDF) 10 Page - Eudyna Devices Inc |
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FMM5826X Scheda tecnica(HTML) 10 Page - Eudyna Devices Inc |
10 / 13 page 10 Ka-Band Power Amplifier MMIC FMM5826X ■ ■ ■ ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) 0 0 1215 2805 0 1215 135 910 1680 2200 2700 600 0 2805 135 910 1680 2200 2700 600 695 695 140 140 1110 1110 Chip Size : 2805± ± ± ± 30um x 1215± ± ± ± 30um Chip Thickness : 60± ± ± ± 20um Bonding Pad Size : 160um x 80um(RF, VGG), 80um x 80um (VDD) VDD1 VDD2 VDD3 VGG RF-IN RF-OUT |
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