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TDA2595V9 Scheda tecnica(PDF) 11 Page - NXP Semiconductors |
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TDA2595V9 Scheda tecnica(HTML) 11 Page - NXP Semiconductors |
11 / 12 page March 1987 11 Philips Semiconductors Product specification Horizontal combination TDA2595 PACKAGE OUTLINE REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT102-1 93-10-14 95-01-23 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 3.9 3.4 0.254 2.54 7.62 8.25 7.80 9.5 8.3 0.85 4.7 0.51 3.7 inches 0.055 0.044 0.021 0.015 0.013 0.009 1.40 1.14 0.055 0.044 0.86 0.84 0.26 0.24 0.15 0.13 0.01 0.10 0.30 0.32 0.31 0.37 0.33 0.033 0.19 0.020 0.15 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 18 1 10 9 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 |
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