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LM27213SQX Scheda tecnica(PDF) 7 Page - National Semiconductor (TI) |
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LM27213SQX Scheda tecnica(HTML) 7 Page - National Semiconductor (TI) |
7 / 22 page Electrical Characteristics Specifications with standard typeface are for T J = 25˚C, and those in bold face type apply over a junction temperature range of -5˚C to +110˚C. Unless otherwise specified, VDD = 5V, SGND = DGND = PGND = SRCK = 0V, unless otherwise stated. (Note 5) (Continued) Symbol Parameter Conditions Min Typ Max Units Drivers I qdriver Driver Quiescent current High drive = low, Low drive = high V CBOOT =VDVDD =5V 14 100 µA Top Driver pull-up current V DVdd = 5V, Load = 0.1 Ω 3A Top Drive pull-up Rds_on I CBOOT =IHG = 0.7A 1.2 Ω Top Drive pull-down current V DVdd = 5V, Load = 0.1 Ω -3.2 A Top Drive pull-down Rds_on I sw =IHG = 0.7A 0.6 Ω T RISEHG Top drive rise time C load = 3.3nF, (10% to 90%) 17 ns t FALLHG Top drive fall time C load = 3.3nF, (10% to 90%) 12 ns Bottom driver pull-up current V DVdd = 5V, Load = 0.1 Ω 3.2 A Bottom Drive pull-up Rds_on I CBOOT =IlG = 0.7A 2.9 Ω Bottom Drive pull-down currrent V DVdd = 5V, Load = 0.1 Ω 3.2 A Bottom Drive pull-down Rds_on I sw =IlG = 0.7A 0.6 Ω T RISELG Bottom Drive rise time C load = 3.3nF, (10% to 90%) 17 ns T FALLLG Bottom Drive fall time C load = 3.3nF, (10% to 90%) 14 ns T DLY Prop delay, CMP to top driver CMP rising above CMPREF (20mV overdrive) to HG dropping to VSW + 0.9 V DVdd,Cload = 3.3nF 89 ns Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table. Functional temperature range is the range within which the device performs its intended functions, but not necessarily meeting the limits specified in the Electrical Characteristic table. Note 2: The maximum allowable power dissipation is calculated by using PDmax =(TJMAX -TA)/θJA , where TJMAX is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance of the specified package. The TSSOP rating of 1.56W results from using 150˚C, 25˚C, and 80˚C/W for TJMAX,TA, and θJA respectively. The θJA of 90˚C/W represents the worst-case condition with no heat sinking of the 48-Pin TSSOP. Heat sinking allows the safe dissipation of more power. The Absolute Maximum power dissipation should be de-rated by 12.5mW per ˚C above 25˚C ambient. The SQA rating of 5.2W results from using 150˚C, 25˚C, and 24.2˚C/W for TJMAX,TA, and θJA respectively. The Absolute Maximum power dissipation should be de-rated by 41mW per ˚C above 25˚C ambient. The LM27213 actively limits its junction temperature to about 150˚C. Note 3: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation. Note 4: For testing purposes, ESD was applied using the human-body model, a 100pF capacitor discharged through a 1.5k Ω resistor. Note 5: All limits are guaranteed at room temperature (standard face type) and at temperature extremes (bold face type). All room temperature limits are 100% production tested. All limits at temperature extremes are guaranteed via correlation using Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 6: The SW pin can have -2V to -0.5 volts applied for a maximum duty cycle of 10% with a minimum frequency of 1Hz. There is no duty cycle or maximum period limitation for a SW pin voltage range of -0.5V to 30 Volts. www.national.com 7 |
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