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LM27213SQX Scheda tecnica(PDF) 7 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Il numero della parte LM27213SQX
Spiegazioni elettronici  Single Phase Hysteretic Buck Controller
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Produttore elettronici  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM27213SQX Scheda tecnica(HTML) 7 Page - National Semiconductor (TI)

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Electrical Characteristics Specifications with standard typeface are for T
J = 25˚C, and those in bold face
type apply over a junction temperature range of -5˚C to +110˚C. Unless otherwise specified, VDD = 5V, SGND = DGND =
PGND = SRCK = 0V, unless otherwise stated. (Note 5) (Continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Drivers
I
qdriver
Driver Quiescent current
High drive = low, Low drive = high
V
CBOOT =VDVDD =5V
14
100
µA
Top Driver pull-up current
V
DVdd = 5V, Load = 0.1
3A
Top Drive pull-up Rds_on
I
CBOOT =IHG = 0.7A
1.2
Top Drive pull-down current
V
DVdd = 5V, Load = 0.1
-3.2
A
Top Drive pull-down Rds_on
I
sw =IHG = 0.7A
0.6
T
RISEHG
Top drive rise time
C
load = 3.3nF, (10% to 90%)
17
ns
t
FALLHG
Top drive fall time
C
load = 3.3nF, (10% to 90%)
12
ns
Bottom driver pull-up current
V
DVdd = 5V, Load = 0.1
3.2
A
Bottom Drive pull-up Rds_on
I
CBOOT =IlG = 0.7A
2.9
Bottom Drive pull-down currrent
V
DVdd = 5V, Load = 0.1
3.2
A
Bottom Drive pull-down Rds_on
I
sw =IlG = 0.7A
0.6
T
RISELG
Bottom Drive rise time
C
load = 3.3nF, (10% to 90%)
17
ns
T
FALLLG
Bottom Drive fall time
C
load = 3.3nF, (10% to 90%)
14
ns
T
DLY
Prop delay, CMP to top driver
CMP rising above CMPREF (20mV
overdrive) to HG dropping to VSW +
0.9 V
DVdd,Cload = 3.3nF
89
ns
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table. Functional temperature range is the
range within which the device performs its intended functions, but not necessarily meeting the limits specified in the Electrical Characteristic table.
Note 2: The maximum allowable power dissipation is calculated by using PDmax =(TJMAX -TA)/θJA , where TJMAX is the maximum junction temperature, TA is the
ambient temperature, and
θJA is the junction-to-ambient thermal resistance of the specified package. The TSSOP rating of 1.56W results from using 150˚C, 25˚C,
and 80˚C/W for TJMAX,TA, and θJA respectively. The θJA of 90˚C/W represents the worst-case condition with no heat sinking of the 48-Pin TSSOP. Heat sinking
allows the safe dissipation of more power. The Absolute Maximum power dissipation should be de-rated by 12.5mW per ˚C above 25˚C ambient. The SQA rating
of 5.2W results from using 150˚C, 25˚C, and 24.2˚C/W for TJMAX,TA, and θJA respectively. The Absolute Maximum power dissipation should be de-rated by 41mW
per ˚C above 25˚C ambient. The LM27213 actively limits its junction temperature to about 150˚C.
Note 3: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation.
Note 4: For testing purposes, ESD was applied using the human-body model, a 100pF capacitor discharged through a 1.5k
Ω resistor.
Note 5: All limits are guaranteed at room temperature (standard face type) and at temperature extremes (bold face type). All room temperature limits are 100%
production tested. All limits at temperature extremes are guaranteed via correlation using Statistical Quality Control (SQC) methods. All limits are used to calculate
Average Outgoing Quality Level (AOQL).
Note 6: The SW pin can have -2V to -0.5 volts applied for a maximum duty cycle of 10% with a minimum frequency of 1Hz. There is no duty cycle or maximum
period limitation for a SW pin voltage range of -0.5V to 30 Volts.
www.national.com
7


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