MC100EP223

MOTOROLA

TIMING SOLUTIONS

DL207 — Rev 0

4

APPLICATIONS INFORMATION

Using the thermally enhanced package of the

MC100EP223

The MC100EP223 uses a thermally enhanced 64 lead

LQFP package. This package provides the low thermal

impedance that supports the power consumption of the

MC100EP223 high-speed bipolar integrated circuit and

eases the power management task for the system design. An

exposed pad at the bottom of the package establishes

thermal conductivity from the package to the printed circuit

board. In order to take advantage of the enhanced thermal

capabilitites of this package, it is recommended to solder the

exposed pad of the package to the printed circuit board. The

attachment process for exposed pad package is the same as

for any standard surface mount package. Vias are

recommended from the pad on the board down to an

appropriate plane in the board that is capable of distributing

the heat. In order to supply enough solder paste to fill those

vias and not starve the solder joints, it may be required to

stencil print solder paste onto the printed circuit pad. This pad

should match the dimensions of the exposed pad. The

dimensions of the exposed pad are shown on the package

outline in this specification. For thermal system analysis and

junction temperature calculation the thermal resistance

parameters of the package is provided:

Thermal Resistance

Convection

LFPM

RTHJAa

°C/W

RTHJAb

°C/W

RTHJCc

°C/W

RTHJBd

°C/W

Natural

57.1

24.9

100

50.0

21.3

200

46.9

20.0

15.8

9.7

400

43.4

18.7

800

38.6

16.9

a.

Junction to ambient, single layer test board, per JESD51-6

b.

Junction to ambient, four conductor layer test board (2S2P),

per JES51-6

c.

Junction to case, per MIL-SPEC 883E, method 1012.1

d.

Junction to board, four conductor layer test board (2S2P) per

JESD 51-8

It is recommended that users employ thermal modeling

analysis to assist in applying the general recommendations

to their particular application. The exposed pad of the

MC100EP223 package does not have an electrical low

impedance path to the substrate of the integrated circuit and

its terminals.