type apply over the full operating ambient temperature range (−30˚C

≤ T

≤ +85˚C). Unless otherwise noted,

specifications apply to the LM3204 with: PV

Symbol

Parameter

Conditions

Min

Typ

Max

Units

V

IL

Logic Low Input

Threshold for EN, BYP

0.4

V

I

PIN

Pin Pull Down Current

for EN, BYP

EN, BYP = 3.6V

5

10

µA

Gain

V

3

V/V

I

CON

V

Current

V

10

nA

in the typical application circuit are used. These parameters are not guaranteed by production testing.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

T

RESPONSE

Time for V

0.8V to 3.4V in PWM Mode

V

R

Ω

L = 2.2 µH (I

25

µs

T

STARTUP

Time for V

in PWM Mode

(Note 14)

V

R

Ω

L = 2.2µH (I

EN = Low to High

50

µs

C

CON

V

V

Test frequency = 100kHz

15

pF

T

ON_BYP

Bypass FET Turn On Time

In Bypass Mode

V

C

Ω

BYP = Low to High

30

µs

T

BYP

Auto Bypass Detect Delay

Time

(Note 10)

10

15

20

µs

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the

Electrical Characteristics tables.

Note 2: All voltages are with respect to the potential at the GND pins.

130˚C (typ.).

Note 4: The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200pF

capacitor discharged directly into each pin. National Semiconductor recommends that all integrated circuits be handled with appropriate precautions. Failure to

observe proper ESD handling techniques can result in damage.

Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be

Note 6: Junction-to-ambient thermal resistance (

standard JESD51-7. A 1" x 1", 4 layer, 1.5oz. Cu board was used for the measurements.

Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 8: The LM3204 is designed for mobile phone applications where turn-on after power-up is controlled by the system controller and where requirements for a

small package size overrule increased die size for internal Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low

until the input voltage exceeds 2.7V.

Note 11: Shutdown current includes leakage current of PFET and Bypass FET.

Note 12: Electrical Characteristic table reflects open loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated).

Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Closed loop current limit is the peak inductor current

measured in the application circuit by increasing output current until output voltage drops by 10%.

Note 14: The startup time is the time to reach 90% of 3.4V nominal output voltage from the EN being low to high.

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