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BD87581YG-C Scheda tecnica(PDF) 3 Page - Rohm |
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BD87581YG-C Scheda tecnica(HTML) 3 Page - Rohm |
3 / 24 page 3/21 © 2019 ROHM Co., Ltd. All rights reserved. 16.Jun.2020 Rev.002 www.rohm.com BD87581YG-C BD87582YFVM-C TSZ22111 • 15 • 001 TSZ02201-0GDG2G500030-1-2 Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Supply Voltage VDD-VSS 15.5 V Differential Input Voltage(Note 1) VID VDD-VSS V Common-mode Input Voltage Range VICMR (VSS - 0.3) to (VDD + 0.3) V Input Current II ±10 mA Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg - 55 to +150 °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input. The input pin voltage is set to VSS or more. Thermal Resistance(Note 2) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 4) 2s2p(Note 5) SSOP5 Junction to Ambient θJA 376.5 185.4 °C/W Junction to Top Characterization Parameter(Note 3) ΨJT 40 30 °C/W MSOP8 Junction to Ambient θJA 284.1 135.4 °C/W Junction to Top Characterization Parameter(Note 3) ΨJT 21 11 °C/W (Note 2) Based on JESD51-2A(Still-Air). (Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 4) Using a PCB board based on JESD51-3. (Note 5) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Operating Supply Voltage VDD 4.0 ±2.0 - 14.0 ±7.0 V Operating Temperature Topr - 40 +25 +125 °C |
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