BD87581YG-C datasheet(3/24 Pages) ROHM

Il numero della parte	BD87581YG-C

Spiegazioni elettronici	Automotive Excellent EMI Characteristics Input/Output Rail-to-Rail CMOS Operational Amplifier

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Produttore elettronici	ROHM [Rohm]

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16.Jun.2020 Rev.002

www.rohm.com

BD87581YG-C

BD87582YFVM-C

TSZ22111 • 15 • 001

TSZ02201-0GDG2G500030-1-2

Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

Unit

Supply Voltage

VDD-VSS

15.5

V

Differential Input Voltage(Note 1)

VID

VDD-VSS

V

Common-mode Input Voltage Range

VICMR

(VSS - 0.3) to (VDD + 0.3)

V

Input Current

II

±10

mA

Maximum Junction Temperature

Tjmax

150

°C

Storage Temperature Range

Tstg

-

55 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.

The input pin voltage is set to VSS or more.

Thermal Resistance(Note 2)

Parameter

Symbol

Thermal Resistance (Typ)

Unit

1s(Note 4)

2s2p(Note 5)

SSOP5

Junction to Ambient

θJA

376.5

185.4

°C/W

Junction to Top Characterization Parameter(Note 3)

ΨJT

40

30

°C/W

MSOP8

Junction to Ambient

θJA

284.1

135.4

°C/W

Junction to Top Characterization Parameter(Note 3)

ΨJT

21

11

°C/W

(Note 2) Based on JESD51-2A(Still-Air).

(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 4) Using a PCB board based on JESD51-3.

(Note 5) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70 μm

Layer Number of

Measurement Board

Material

Board Size

4 Layers

FR-4

114.3 mm x 76.2 mm x 1.6 mmt

Top

2 Internal Layers

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

70 μm

Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Operating Supply Voltage

VDD

4.0

±2.0

-

14.0

±7.0

V

Operating Temperature

Topr

-

40

+25

+125

°C

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