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BD63621MUV Scheda tecnica(PDF) 5 Page - Rohm |
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BD63621MUV Scheda tecnica(HTML) 5 Page - Rohm |
5 / 29 page 5/24 BD63621MUV TSZ02201-0P2P0B701290-1-2 © 2017 ROHM Co., Ltd. All rights reserved. 21.Dec.2020 Rev.002 www.rohm.com TSZ22111・15・001 ○CR/Connection terminal of CR for setting chopping frequency This is the terminal to set the chopping frequency of output. Please connect the external C(470p to 3300pF) and R(10k to 200k Ω) between this terminal and GND. Please refer to P.7. Please interconnect from external components to GND in such a way that the interconnection does not have impedance in common with other GND patterns. In addition, please carry out the pattern design in such ways as keeps such steep pulses as square wave etc. away and that there is no noise plunging. Please mount the two components of C and R if being used by PWM constant current control because normal PWM constant current control becomes impossible if CR terminal is open or it is biased externally. ○MTH/Current decay mode-setting terminal This is the terminal to set the current decay mode. Current decay mode can be optionally set according to input voltage. MTH terminal input voltage[V] Current decay mode 0 to 0.3 SLOW DECAY 0.4 to 1.0 MIX DECAY 1.5 to 3.5 FAST DECAY Please connect to GND if using at SLOW DECAY mode. Please avoid using with MTH terminal open because if MTH terminal is open, the input is unsettled, and then there is the danger that PWM operation becomes unstable. Besides, please take into consideration the outflow current (Max2µA) if inputted by resistance division when selecting the resistance value. ○TEST/Terminal for inspection This terminal is used for delivery inspection on IC, and shall be grounded before use. In addition, malfunctions may be caused by application without grounding. ○NC terminal This terminal is unconnected electrically with IC internal circuit. ○IC back metal For VQFN028V5050 package, the heat- radiating metal is mounted on IC’s back side, and on the metal the heat-radiating treatment is performed when in use, which becomes the precondition to use, so please secure sufficiently the heat-radiating area by surely connecting by solder with the GND plane on the board and getting as wide GND pattern as possible. Moreover, the back side metal is shorted with IC chip’s back side and becomes the GND potential, so there is the danger of malfunction and destruction if shorted with potentials other than GND, therefore please absolutely do not design patterns other than GND through the IC’s back side. |
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