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BD63621MUV Scheda tecnica(PDF) 10 Page - Rohm

Il numero della parte BD63621MUV
Spiegazioni elettronici  Stepping Motor Driver
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Produttore elettronici  ROHM [Rohm]
Homepage  http://www.rohm.com
Logo ROHM - Rohm

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BD63621MUV
TSZ02201-0P2P0B701290-1-2
© 2017 ROHM Co., Ltd. All rights reserved.
21.Dec.2020 Rev.002
www.rohm.com
TSZ22111・15・001
Absolute Maximum Ratings (Ta=25°C)
Item
Symbol
Rated Value
Unit
Supply voltage
VCC1,2
-0.2 to +36.0
V
Input voltage for control pin
VIN
-0.2 to +5.5
V
RNF maximum voltage
VRNF
0.7
V
Maximum output current (DC)
IOUT
2.0
1
A/Phase
Maximum output current
(Peak)
2
IOUTPEAK
2.5
1
A/Phase
Operating temperature range
Topr
-25 to +85
°C
Storage temperature range
Tstg
-55 to +150
°C
Maximum Junction temperature
Tjmax
+150
°C
※1 Do not, however exceed Tjmax=150°C.
※2 Pulse width tw
≤1ms, duty 20%.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration
by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Recommended Operating Conditions (Ta= -25 to +85°C)
Item
Symbol
Rated Value
Unit
Supply voltage
VCC1,2
8 to 28
V
Maximum Output current (DC)
IOUT
1.7
3
A/ Phase
※3 Not exceeding Tj=150°C.
Thermal Resistance
4
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s
6
2s2p
7
VQFN028V5050
Junction to Ambient
θJA
128.5
31.5
°C/W
Junction to Top Characterization Parameter
5
ΨJT
12
9
°C/W
※4 Based on JESD51-2A(Still-Air)
※5 The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
※6 Using a PCB board based on JESD51-3
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70µm
※7 Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70µm
74.2mm x 74.2mm
35µm
74.2mm x 74.2mm
70µm


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