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BD63621MUV Scheda tecnica(PDF) 10 Page - Rohm |
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BD63621MUV Scheda tecnica(HTML) 10 Page - Rohm |
10 / 29 page 10/24 BD63621MUV TSZ02201-0P2P0B701290-1-2 © 2017 ROHM Co., Ltd. All rights reserved. 21.Dec.2020 Rev.002 www.rohm.com TSZ22111・15・001 Absolute Maximum Ratings (Ta=25°C) Item Symbol Rated Value Unit Supply voltage VCC1,2 -0.2 to +36.0 V Input voltage for control pin VIN -0.2 to +5.5 V RNF maximum voltage VRNF 0.7 V Maximum output current (DC) IOUT 2.0 ※1 A/Phase Maximum output current (Peak) ※2 IOUTPEAK 2.5 ※1 A/Phase Operating temperature range Topr -25 to +85 °C Storage temperature range Tstg -55 to +150 °C Maximum Junction temperature Tjmax +150 °C ※1 Do not, however exceed Tjmax=150°C. ※2 Pulse width tw ≤1ms, duty 20%. Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Recommended Operating Conditions (Ta= -25 to +85°C) Item Symbol Rated Value Unit Supply voltage VCC1,2 8 to 28 V Maximum Output current (DC) IOUT 1.7 ※3 A/ Phase ※3 Not exceeding Tj=150°C. Thermal Resistance ※4 Parameter Symbol Thermal Resistance (Typ) Unit 1s ※6 2s2p ※7 VQFN028V5050 Junction to Ambient θJA 128.5 31.5 °C/W Junction to Top Characterization Parameter ※5 ΨJT 12 9 °C/W ※4 Based on JESD51-2A(Still-Air) ※5 The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. ※6 Using a PCB board based on JESD51-3 Layer Number of Measurement Board Material Board Size Single FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70µm ※7 Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70µm 74.2mm x 74.2mm 35µm 74.2mm x 74.2mm 70µm |
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