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CS5231-3GDP5 Scheda tecnica(PDF) 9 Page - ON Semiconductor

Il numero della parte CS5231-3GDP5
Spiegazioni elettronici  500 mA, 3.3 V Linear Regulator with Auxiliary Control
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Produttore elettronici  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CS5231-3GDP5 Scheda tecnica(HTML) 9 Page - ON Semiconductor

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CS5231−3
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9
need for an external reset signal. The monitoring circuitry is
located near the composite PNP−NPN output transistor,
since this transistor is responsible for most of the on−chip
power dissipation. The combination of current limit and
thermal shutdown will protect the IC from nearly any fault
condition.
REVERSE CURRENT PROTECTION
During normal system operation, the auxiliary drive
circuitry will maintain voltage on the VOUT pin when VIN
is absent. IC reliability and system efficiency are improved
by limiting the amount of reverse current that flows from
VOUT to ground and from VOUT to VIN. Current flows from
VOUT to ground through the feedback resistor divider that
sets up the output voltage This resistor can range in value
from 6.0 k
W to about 10 kW, and roughly 500 mA will flow
in the typical case. Current flow from VOUT to VIN will be
limited to leakage current after the IC shuts down. On−chip
RC time constants are such that the output transistor should
be turned off well before VIN drops below the VOUT voltage.
CALCULATING POWER DISSIPATION AND
HEATSINK REQUIREMENTS
Most linear regulators operate under conditions that result
in high on−chip power dissipation. This results in high
junction temperatures. Since the IC has a thermal shutdown
feature, ensuring the regulator will operate correctly under
normal conditions is an important design consideration.
Some heatsinking will usually be required.
Thermal characteristics of an IC depend on four
parameters: ambient temperature (TA in °C), power
dissipation (PD in watts), thermal resistance from the die to
the ambient air (
qJA in °C per watt) and junction temperature
(TJ in °C). The maximum junction temperature is calculated
from the formula below:
TJ(MAX) + TA(MAX) ) (qJA
PD(MAX))
Maximum ambient temperature and power dissipation are
determined by the design, while
qJA is dependent on the
package manufacturer. The maximum junction temperature
for operation of the CS5231−3 within specification is
150
°C. The maximum power dissipation of a linear
regulator is given as
PD(MAX) + (VIN(MAX) * VOUT(MIN))
(ILOAD(MAX) ) VIN(MAX))
IGND(MAX)
where IGND(MAX) is the IC bias current.
It is possible to change the effective value of
qJA by adding
a heatsink to the design. A heatsink serves in some manner
to raise the effective area of the package, thus improving the
flow of heat from the package into the surrounding air. Each
material in the path of heat flow has its own characteristic
thermal resistance, all measured in
°C per watt. The thermal
resistances are summed to determine the total thermal
resistance between the die junction and air. There are three
components of interest: junction−to−case thermal resistance
(
qJC), case−to−heatsink thermal resistance (qCS) and
heatsink−to−air thermal resistance (
qSA). The resulting
equation for junction−to−air thermal resistance is
qJA + qJC ) qCS ) qSA
The value of
qJC both packages of the CS5231−3 are
provided in the Packaging Information section of this data
sheet. The value of
qCS can be considered zero, since heat is
conducted out of the D2PAK package by the IC leads and the
tab, and out of the SOIC−8 package by its IC leads that are
soldered directly to the PC board.
Modification of
qSA is the primary means of thermal
management. For surface mount components, this means
modifying the amount of trace metal that connects to the IC.
The thermal capacity of PC board traces is dependent on
how much copper area is used, whether or not the IC is in
direct contact with the metal, whether or not the metal
surface is coated with some type of sealant, and whether or
not there is airflow across the PC board. The chart provided
below shows heatsinking capability of a square, single sided
copper PC board trace. The area is given in square
millimeters, and it is assumed there is no airflow across the
PC board.
Figure 20. Thermal Resistance Capability of
Copper PC Board Metal Traces
PC Board Trace Area (mm2)
70
0
2000
50
60
40
30
20
10
0
4000
6000
TYPICAL D2PAK PC BOARD HEATSINK DESIGN
A typical design of the PC board surface area needed for
the D2PAK package is shown on page 11. Calculations were
made assuming VIN(MAX) = 5.25 V, VOUT(MIN) = 3.266 V,
IOUT(MAX) = 500 mA, IGND(MAX) = 5.0 mA and TA = 70°C.
PD + (5.25 V * 3.266 V)
0.5 A
) (5.25 V)(0.005 A) + 1018 mW
Maximum temperature rise
DT + TJ(MAX) * TA + 150°C * 70°C + 80°C
qJA(worst case) + DT PD + 80°C 1.018 W + 78.56°C W


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