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L6100140 Scheda tecnica(PDF) 7 Page - Semikron International |
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L6100140 Scheda tecnica(HTML) 7 Page - Semikron International |
7 / 9 page Board 2s SKYPER™ 32 - Technical Explanations 7 / 9 2005-06-08 – Rev02 © by SEMIKRON Boost Capacitors Cboost15P & Cboost8N Designation Pattern Name Setting C151 1210 Cboost8N Factory setting: 4,7µF/16V * TOP C152 1210 Cboost15P Factory setting: 2,2µF/25V * TOP C251 1210 Cboost8N Factory setting: 4,7µF/16V * BOT C252 1210 Cboost15P Factory setting: 2,2µF/25V * BOT * output charge pulse: 5µC Temperature Signal The temperature sensor inside the SEMiX ® module is directly connected to contacting points T1 and T2. For details to the temperature sensor, see Modules Explanations SEMiX ®. Mounting Notes The electrical connections between evaluation board and SEMiX ® are realised via spring contacts integrated in SEMiX ® power modules and via landing pads on the bottom side of the evaluation board. Evaluation Board & Driver Core Mounting 1. Soldering of components (e.g. RGon, RGoff, etc.) on adapter board. 2. Evaluation Board has to be fixed to the SEMiX ® module (see "Mounting Instruction and Application Notes for SEMiX ® IGBT modules" on SEMiX® product overview page at http://www.semikron.com). 3. Insert driver core into the box connector on evaluation board. SKYPER™ 32 Evaluation Board Support post The connection between driver core and evaluation board should be mechanical reinforced by using support posts. The posts have to be spaced between driver core and evaluation board. Product information of suitable support posts and distributor contact information is available at e.g. http://www.richco- inc.com (part number MSPM-8-01). Safety Warnings: The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential isolation that protect the high voltage sections / wires from accidental human contact. |
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