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OPA991 Scheda tecnica(PDF) 11 Page - Texas Instruments |
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OPA991 Scheda tecnica(HTML) 11 Page - Texas Instruments |
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11 / 75 page  6 Specifications 6.1 Absolute Maximum Ratings over operating ambient temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VS = (V+) – (V–) 0 42 V Signal input pins Common-mode voltage (3) (V–) – 0.5 (V+) + 0.5 V Differential voltage (3) VS + 0.2 V Current (3) –10 10 mA Output short-circuit (2) Continuous Operating ambient temperature, TA –55 150 °C Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Operating the device beyond the ratings listed under Absolute Maximum Ratings will cause permanent damage to the device. These are stress ratings only, based on process and design limitations, and this device has not been designed to function outside the conditions indicated under Recommended Operating Conditions. Exposure to any condition outside Recommended Operating Conditions for extended periods, including absolute-maximum-rated conditions, may affect device reliability and performance. (2) Short-circuit to ground, one amplifier per package. This device has been designed to limit electrical damage due to excessive output current, but extended short-circuit current, especially with higher supply voltage, can cause excessive heating and eventual thermal destruction. See the Thermal Protection section for more information. (3) Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) MIN MAX UNIT VS Supply voltage, (V+) – (V–) 2.7 40 V VI Input voltage range (V–) – 0.1 (V+) + 0.1 V VIH High level input voltage at shutdown pin (amplifier enabled) 1.1 (V+) V VIL Low level input voltage at shutdown pin (amplifier disabled) (V–) 0.2 V TA Specified temperature –40 125 °C 6.4 Thermal Information for Single Channel THERMAL METRIC (1) OPA991, OPA991S UNIT DBV (2) (SOT-23) DCK (2) (SC70) DRL (2) (SOT-553) 5 PINS 6 PINS 5 PINS 5 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 185.7 167.8 202.6 TBD TBD °C/W RθJC(top) Junction-to-case (top) thermal resistance 108.2 107.9 101.5 TBD TBD °C/W RθJB Junction-to-board thermal resistance 54.5 49.7 47.8 TBD TBD °C/W ψJT Junction-to-top characterization parameter 31.2 33.9 18.8 TBD TBD °C/W ψJB Junction-to-board characterization parameter 54.2 49.5 47.4 TBD TBD °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A TBD TBD °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. www.ti.com OPA991, OPA2991, OPA4991 SBOS969D – OCTOBER 2019 – REVISED JULY 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 11 |
Codice articolo simile - OPA991_V05 |
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