Motore di ricerca datesheet componenti elettronici |
|
TS2576CZ5-33 Scheda tecnica(PDF) 6 Page - Taiwan Semiconductor Company, Ltd |
|
TS2576CZ5-33 Scheda tecnica(HTML) 6 Page - Taiwan Semiconductor Company, Ltd |
6 / 7 page TS2576 6-7 2003/12 rev. A Grounding To maintain output voltage stability, the power ground connections must be low-impedance. For the 5-lead TO-220 and TO-263 style package, both the tab and pin 3 are ground and rather connection may be used. Thermal Characteristics The output ripple voltage is due mainly to the inductor sawtooth ripple current multiplied by the ESR of the output capacitor. The output ripple voltage of a switching power supply will contain a sawtooth ripple voltage at the switcher frequency, typically about 1% of the output voltages, and may also contain short voltage spokes of the sawtooth waveform. Due to the fast switching action, and the parasitic inductance of the output filter capacitor, there is voltage spikes presenting at the peaks of the sawtooth waveform. Cautions must be taken for stray capacitance. Wiring inductance, and even the scope probes used for transients evaluation. To minimize these voltage spikes, shortening the lead length and PCB traces is always the first thought. Further more, an additional small LC filter (30µH & 100µF) (as shown in Figure 3) will possibly provide a 10X reduction in output ripple voltage and transients. Heatsink and Thermal Consideration Although the TS2576 requires only a small heatsink for most cases, the following thermal consideration is important for all operation. With the package thermal resistances Өja and Өjc , total power dissipation can be estimated as follows: PD= (Vin x Iq) + (Vout / Vin) (Iout x Vsat); When no heatsink is used, the junction temperature rise can be determined by the following: ∆TJ = PD x Өja With the ambient temperature, the actual junction temperature will be: Tj = ∆Tj + Ta If the actual operating junction temperature is out of the safe operating junction temperature (typically 125 oC), then a heatsink is required. When using a heatsink, the junction temperature rise will be reduced by the following : ∆Tj= PD x (Өjc + Ө interface + Ө heatsink ); Also one can see from the above, it is important to choose an heatsink with adequate size and thermal resistance, such that to maintain the regulator’s junction temperature below the maximum operating temperature. |
Codice articolo simile - TS2576CZ5-33 |
|
Descrizione simile - TS2576CZ5-33 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEETIT.COM |
Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |