FM5822-A

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant EpoxyMolding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDEC DO-214AC

Terminals : Solder plated, s olderable per MIL-STD-750,

Method 2026

Polarity : Indicated by cathode band

Mounting Position : Any

Weight : 0.0015 ounce, 0.15 gr am

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.1

3.0

A

25

0.42

V

25

0.49

V

125

0.34

V

125

0.43

V

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

80

A

peak reverse voltage

40

V

RMS voltage

28

V

Continuous reverse voltage

40

V

25

0.5

mA

20

mA

Thermal resistance

Junction to ambient

80

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

250

pF

Operating temperature

-55

+150

Storage temperature

-55

+150

Reverse current

Forward voltage

Chip Schottky Barrier Diodes

Silicon epitaxial planer type

Formosa MS

0.185(4.8)

0.173(4.4)

0.012(0.3) Typ.

0.110(2.8)

0.094(2.4)

0.165(4.2)

0.150(3.8)

0.067(1.7)

0.060(1.5)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMA