FM320-B THRU FM3100-B

(V)

(V)

(V)

(V)

(

FM320-B

SS32

20

14

20

FM330-B

SS33

30

21

30

FM340-B

SS34

40

28

40

FM350-B

SS35

50

35

50

FM360-B

SS36

60

42

60

FM380-B

SS38

80

56

80

FM3100-B

S310

100

70

100

SYMBOLS

MARKING

CODE

Operating

temperature

*1

*2

*3

*4

0.50

0.75

0.85

-55 to +125

-55 to +150

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.1

3.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

80

A

25

0.5

mA

20

mA

Thermal resistance

Junction to ambient

55

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

250

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Chip Schottky Barrier Diodes

Silicon epitaxial planer type

Formosa MS

0.213(5.4)

0.197(5.0)

0.016(0.4) Typ.

0.142(3.6)

0.126(3.2)

0.173(4.4)

0.157(4.0)

0.075(1.9)

0.067(1.7)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMB

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECDO-214AA

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.00878 ounce, 0.293 gram