IN

OUT

GND

EN

½

TLV751P

V

OUT

V

IN

FB

C

IN

C

OUT

V

EN

R

2

R

1

16

TLV751

SBVS385B – DECEMBER 2019 – REVISED APRIL 2020

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Adjustable Device Feedback Resistors

Figure 38 shows that the output voltage of the TLV751 can be adjusted from 0.55 V to 5.5 V by using a resistor

divider network.

Figure 38. Adjustable Operation

(2)

current listed in the Electrical Characteristics table. This setting provides the maximum feedback divider series

resistance, as shown in the following equation:

(3)

8.1.2 Input and Output Capacitor Selection

The TLV751 requires an output capacitance of 0.47 µF or larger for stability. Use X5R- and X7R-type ceramic

capacitors because these capacitors have minimal variation in value and equivalent series resistance (ESR) over

temperature. When choosing a capacitor for a specific application, pay attention to the dc bias characteristics for

the capacitor. Higher output voltages cause a significant derating of the capacitor. For best performance, the

maximum recommended output capacitance is 220 µF.

Although an input capacitor is not required for stability, good analog design practice is to connect a capacitor

from IN to GND. Some input supplies have a high impedance, thus placing the input capacitor on the input

supply helps reduce the input impedance. This capacitor counteracts reactive input sources and improves

transient response, input ripple, and PSRR. If the input supply has a high impedance over a large range of

frequencies, several input capacitors can be used in parallel to lower the impedance over frequency. Use a

higher-value capacitor if large, fast, rise-time load transients are anticipated, or if the device is located several

inches from the input power source.