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ECS-9000-POER Datasheet(Scheda tecnica) 1 Page - Vecow Co., Ltd.

Numero della parte ECS-9000-POER
Dettagli  ECS-9000, 6 GigE LAN with 4 PoE, 2 SSD Tray, 6 USB 3.0, 4 COM, 3 SIM, Isolated DIO
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Produttore  VECOW [Vecow Co., Ltd.]
Homepage  http://www.vecow.com
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ECS-9000-POER Datasheet(HTML) 1 Page - Vecow Co., Ltd.

   
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Specifications
Features
High-performance Fanless Systems
ECS-9000-PoER
ƒ
LGA 1151 Socket supports workstation-grade Intel® Xeon®/
Core™ i7/i5/i3 Processor with Intel® C236 Chipset
ƒ
Fanless, -40°C to 75°C Operating Temperature
ƒ
6 GigE LAN with 4 IEEE 802.3at PoE+, iAMT 11.0 supported
ƒ
DVI-I, DVI-D and DisplayPort display interface, up to 4K display
ƒ
Front-access : 2 2.5" SSD Tray, 3 SIM Socket, 1 CFast, 4 USB 3.0
ƒ
3 Mini PCIe for WiFi/4G/3G/LTE/GPES/UMTS
ƒ
16 Isolated DIO, 4 COM, 6 USB 3.0
ƒ
6V to 36V DC Power Input with 80V Surge Protection
ƒ
Configurable Ignition Power Control
Quad Core Intel® Xeon®/Core™ i7/i5/i3 (Kaby Lake) Fanless Embedded System with Intel® C236 Chipset, 6 GigE LAN with 4 PoE+, 2 Front-access
SSD Tray, 3 SIM, 6 USB 3.0, Isolated DIO, High Performance, Rugged, -40°C to 75°C Extended Temperature
System
Processor
Intel
® Xeon®/Core™ i7/i5/i3 Processor (Kaby Lake-S/Skylake-S)
Chipset
Intel
® C236
BIOS
AMI
SIO
IT8786E
Memory
2 DDR4 2400/2133 MHz SO-DIMM, up to 64GB
I/O Interface
Serial
4 COM RS-232/422/485
USB
ƒ
6 USB 3.0 (External)
ƒ
1 USB 2.0 (Internal)
Isolated DIO
16 Isolated DIO : 8 DI, 8 DO
LED
Power, HDD, Wireless, PoE
SIM Card
3 SIM Card Socket (External)
Expansion
Mini PCIe
3 Mini PCIe Socket :
ƒ
2 Full-size for PCIe/USB/External SIM Card/mSATA
ƒ
1 Half-size for PCIe/USB 3.0/External SIM Card
SUMIT A, B
2 SUMIT Slot (Optional)
Graphics
Graphics
Processor
Intel
® HD Graphics P630/630/P530/530
Display
Memory
Shared Memory, up to 1.7GB
Interface
ƒ
DVI-I : Up to 1920 x 1200 @ 60Hz
ƒ
DVI-D : Up to 1920 x 1200 @ 60Hz
ƒ
DisplayPort : Up to 4096 x 2304 @ 60Hz
Storage
SATA
2 SATA III (6Gbps)
mSATA
2 SATA III (Mini PCIe Type, 6Gbps)
SATA DOM
1 SATA II (3Gbps)
Storage
Device
ƒ
1 CFast Socket, Push-in/Push-out Ejector
ƒ
2 Front-access 2.5"SSD/HDD Tray
Audio
Audio Codec
Realtek ALC892, 5.1 Channel HD Audio
Audio
Interface
1 Mic-in, 1 Line-out
Ethernet
LAN 1
Intel
® I219LM GigE LAN supports iAMT 11.0
LAN 2
Intel
® I210 GigE LAN
PoE
LAN 3
GigE IEEE 802.3at (25.5W/48V) PoE
+ by Intel® I210
LAN 4
GigE IEEE 802.3at (25.5W/48V) PoE
+ by Intel® I210
LAN 5
GigE IEEE 802.3at (25.5W/48V) PoE
+ by Intel® I210
LAN 6
GigE IEEE 802.3at (25.5W/48V) PoE
+ by Intel® I210
Power
Power Input
6V to 36V, DC-in
Power
Interface
ƒ
3-pin Terminal Block : V+, V-, Frame Ground
ƒ
Mini-DIN 4-pin
Ignition
Control
16 Mode (Internal)
Remote
Switch
3-pin Terminal Block : On, Off, IGN
Surge
Protection
Up to 80V/1ms Transient Power
Others
TPM
Optional Infineon SLB9665 supports TPM 2.0, LPC Interface
Watchdog
Timer
Reset : 1 to 255 sec./min. per step
Smart
Management
Wake on LAN, PXE supported
HW Monitor
Monitoring temperature, voltages. Auto throttling control
when CPU overheats.
Software Support
OS
Windows 10, Windows 8.1, Windows 7, Linux
Mechanical
Dimensions
260mm x 175mm x 79mm (10.24" x 6.89" x 3.11")
Weight
3.8 kg (8.38 lb)
Mounting
ƒ
Wallmount by mounting bracket
ƒ
DIN Rail Mount (Optional)
ƒ
2U Rackmount (Optional)
Environment
Operating
Temperature
35W TDP CPU :
ƒ
Core™ i7, i5, i3 : -40°C to 75°C (-40°F to 167°F)
ƒ
Xeon
® E3-1268L v5 : -40°C to 70°C (-40°F to 158°F)
65W TDP CPU :
Core™ i7, i5, i3 : -40°C to 55°C (-40°F to 131°F)
80W TDP CPU :
Xeon
® E3-1275 v6, E3-1275 v5, E3-1225 v5 : -40°C to
45°C (-40°F to 113°F)
Storage
Temperature
-40°C to 85°C (-40°F to 185°F)
Humidity
5% to 95% Humidity, non-condensing
Relative
Humidity
95% @ 75°C
Shock
ƒ
IEC 60068-2-27
ƒ
SSD : 50G @ wallmount, Half-sine, 11ms
Vibration
ƒ
IEC 60068-2-64
ƒ
SSD : 5Grms, 5Hz to 500Hz, 3 Axis
Certification
E13, CE, FCC, EN50155, EN50121-3-2


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