74AUP1G79 datasheet(2/20 Pages) PHILIPS

Il numero della parte	74AUP1G79

Spiegazioni elettronici	Low-power D-type flip-flop; positive-edge trigger

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Produttore elettronici	PHILIPS [NXP Semiconductors]

Homepage	http://www.nxp.com

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2 / 20 page

9397 750 14682

Product data sheet

Rev. 01 — 12 September 2005

2 of 20

Philips Semiconductors

74AUP1G79

Low-power D-type ﬂip-ﬂop; positive-edge trigger

3.

Quick reference data

[1]

CPD is used to determine the dynamic power dissipation (PD in µW).

PD =CPD × VCC2 × fi × N+ Σ(CL × VCC2 × fo) where:

fi = input frequency in MHz;

fo = output frequency in MHz;

CL = output load capacitance in pF;

VCC = supply voltage in V;

N = number of inputs switching;

Σ(C

L × VCC

2

× f

o) = sum of the outputs.

4.

Ordering information

5.

Marking

Table 1:

Quick reference data

GND = 0 V; Tamb =25 °C; tr =tf ≤ 3ns.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

tPHL, tPLH propagation delay

CP to Q

CL = 5 pF; RL =1MΩ

VCC = 0.8 V

-

19.7

-

ns

VCC = 1.1 V to 1.3 V

2.6

5.5

11.0

ns

VCC = 1.4 V to 1.6 V

2.0

3.8

7.0

ns

VCC = 1.65 V to 1.95 V

1.7

3.1

5.4

ns

VCC = 2.3 V to 2.7 V

1.4

2.3

4.0

ns

VCC = 3.0 V to 3.6 V

1.2

2.0

3.4

ns

fclk(max)

maximum clock

frequency

CL =30pF;

VCC = 3.0 V to 3.6 V

-

309

-

MHz

Ci

input capacitance

-

0.8

-

pF

CPD

power dissipation

capacitance

f = 10 MHz;

VI = GND to VCC

[1]

VCC = 1.8 V

-

2.3

-

pF

VCC = 3.3 V

-

3.0

-

pF

Table 2:

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74AUP1G79GW

−40 °C to +125 °C

TSSOP5

plastic thin shrink small outline package; 5 leads;

body width 1.25 mm

SOT353-1

74AUP1G79GM

−40 °C to +125 °C

XSON6

plastic extremely thin small outline package; no leads;

6 terminals; body 1

× 1.45 × 0.5 mm

SOT886

Table 3:

Marking

Type number

Marking code

74AUP1G79GW

pP

74AUP1G79GM

pP

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