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LM323T Scheda tecnica(PDF) 2 Page - ON Semiconductor |
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LM323T Scheda tecnica(HTML) 2 Page - ON Semiconductor |
2 / 8 page LM323, A 2 MOTOROLA ANALOG IC DEVICE DATA MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Vin 20 Vdc Power Dissipation PD Internally Limited W Operating Junction Temperature Range TJ 0 to +125 °C Storage Temperature Range Tstg –65 to +150 °C Lead Temperature (Soldering, 10 s) Tsolder 300 °C ELECTRICAL CHARACTERISTICS (TJ = Tlow to Thigh [Note 1], unless otherwise noted.) LM323A LM323 Characteristics Symbol Min Typ Max Min Typ Max Unit Output Voltage (Vin = 7.5 V, 0 ≤ Iout ≤ 3.0 A, TJ = 25°C) VO 4.9 5.0 5.1 4.8 5.0 5.2 V Output Voltage (7.5 V ≤ Vin ≤ 15 V, 0 ≤ Iout ≤ 3.0 A, P ≤ Pmax) (Note 2) VO 4.8 5.0 5.2 4.75 5.0 5.25 V Line Regulation (7.5 V ≤ Vin ≤ 15 V, TJ = 25°C) (Note 3) Regline – 1.0 15 – 1.0 25 mV Load Regulation (Vin = 7.5 V, 0 ≤ Iout ≤ 3.0 A, TJ = 25°C) (Note 3) Regload – 10 50 – 10 100 mV Thermal Regulation (Pulse = 10 ms, P = 20 W, TA = 25°C) Regtherm – 0.001 0.01 – 0.002 0.03 %VO/W Quiescent Current (7.5 V ≤ Vin ≤ 15 V, 0 ≤ Iout ≤ 3.0 A) IB – 3.5 10 – 3.5 20 mA Output Noise Voltage (10 Hz ≤ f ≤ 100 kHz, TJ = 25°C) VN – 40 – – 40 – µVrms Ripple Rejection (8.0 V ≤ Vin ≤ 18 V, Iout = 2.0A, f = 120 Hz, TJ = 25°C) RR 66 75 – 62 75 – dB Short Circuit Current Limit (Vin = 15 V, TJ = 25°C) (Vin = 7.5 V, TJ = 25°C) ISC – – 4.5 5.5 – – – – 4.5 5.5 – – A Long Term Stability S – – 35 – – 35 mV Thermal Resistance, Junction–to–Case (Note 4) R ΘJC – 2.0 – – 2.0 – °C/W NOTES: 1. Tlow to Thigh = 0° to +125°C 2. Although power dissipation is internally limited, specifications apply only for P ≤ Pmax = 25 W. 3. Load and line regulation are specified at constant junction temperature. Pulse testing is required with a pulse width ≤ 1.0 ms and a duty cycle ≤ 5%. 4. Without a heatsink, the thermal resistance (R θJA is 65°C/W). With a heatsink, the effective thermal resistance can approach the specified values of 2.0 °C/W, depending on the efficiency of the heatsink. |
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