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LM2931D-5.0 Scheda tecnica(PDF) 9 Page - ON Semiconductor |
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LM2931D-5.0 Scheda tecnica(HTML) 9 Page - ON Semiconductor |
9 / 16 page LM2931 Series 9 MOTOROLA ANALOG IC DEVICE DATA 40 50 60 70 80 90 100 0 0.4 0.8 1.2 1.6 2.0 2.4 010 20 30 25 15 5.0 L, LENGTH OF COPPER (mm) PD(max) for TA = 50°C Minimum Size Pad L L Free Air Mounted Vertically 30 40 50 60 70 80 1.0 1.5 2.0 2.5 3.0 3.5 010 20 30 25 15 5.0 L, LENGTH OF COPPER (mm) PD(max) for TA = 50°C Minimum Size Pad 2.0 oz. Copper L L Free Air Mounted Vertically 30 50 70 90 110 130 150 0.4 0.8 1.2 1.6 2.0 2.4 2.8 020 30 50 40 10 L, LENGTH OF COPPER (mm) 170 3.2 R θJA 2.0 oz. Copper Graph represents symmetrical layout 3.0 mm L L R θJA R θJA 2.0 oz. Copper Figure 23. SOP–8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length Figure 24. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length Figure 25. 3–Pin and 5–Pin D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length PD(max) for TA = 50°C |
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