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CD4053BQM96Q1 Scheda tecnica(PDF) 5 Page - Texas Instruments |
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CD4053BQM96Q1 Scheda tecnica(HTML) 5 Page - Texas Instruments |
5 / 18 page CD4051BQ1, CD4052BQ1, CD4053BQ1 CMOS ANALOG MULTIPLEXERS/DEMULTIPLEXERS WITH LOGIC-LEVEL CONVERSION SCHS354 − AUGUST 2004 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 logic diagrams (positive logic) (continued) 11 10 9 6 A† B† C† INH† 12 3 5 1 2 13 TG TG TG TG TG TG 4 ax ay bx by cx cy 8 7 16 IN/OUT 15 14 VDD † All inputs are protected by standard CMOS protection network. CD4053B Logic-Level Conversion VDD VSS VEE Binary to 1-of-2 Decoders With Inhibit COM OUT/IN ac or ay COM OUT/IN bc or by COM OUT/IN xc or xy absolute maximum ratings over operating free-air temperature (unless otherwise noted)‡ Supply voltage range, V+ to V− (voltages referenced to VSS terminal) −0.5 to 20 V . . . . . . . . . . . . . . . . . . . . . DC input voltage range −0.5 V to VDD + 0.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC input current, any one input ±10 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 1): M package 73 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PW package 108 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max 265 °C . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. |
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