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HCPL-7723-500 Scheda tecnica(PDF) 5 Page - Agilent(Hewlett-Packard)

Il numero della parte HCPL-7723-500
Spiegazioni elettronici  50 MBd 2 ns PWD High Speed CMOS Optocoupler
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Produttore elettronici  HP [Agilent(Hewlett-Packard)]
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HCPL-7723-500 Scheda tecnica(HTML) 5 Page - Agilent(Hewlett-Packard)

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5
Solder Reflow Temperature Profile
Regulatory Information
The HCPL-7723/0723 will be
approved by the following
organizations:
UL
Recognized under UL1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
VDE
(HCPL-7723 option 060)
Approved according to VDE
0884/06.92, File 6591-23-4880-
1005.
TUV Rheinland
(HCPL-0723 Option 060)
Approved according to VDE
0884/06.92, Certificate
R9650938.
Insulation and Safety Related Specifications
Value
Parameter
Symbol
7723
0723
Units
Conditions
Minimum External Air Gap
L(I01)
7.1
4.9
mm
Measured from input terminals to output
(Clearance)
terminals, shortest distance through air.
Minimum External Tracking
L(I02)
7.4
4.8
mm
Measured from input terminals to output
(Creepage)
terminals, shortest distance path along body.
Minimum Internal Plastic Gap
0.08
0.08
mm
Insulation thickness between emitter and
(Internal Clearance)
detector; also known as distance through
insulation.
Tracking Resistance
CTI
≥ 175
≥ 175
Volts
DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
0
TIME (SECONDS)
200
100
50
150
100
200
250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.


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