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Datasheet (Advance Information)
TC2411
5
MKDSTC2411 Rev-
TC2411 Thermal Characteristics
Normal Mode of Operation
θ
JA (
oC/W)
Package
θ
JC (
oC/W)
0 m/s
2m/s
3m/s
Note
19X19 Cavity-down
BGA 96L
2.72
20.2
18.5
17.5
Results based on FEA simulation
without heat sink.
•
The DC power of the TC2411 is 1.8 W in normal mode of operation
•
Maximum Junction Temperature is not to exceed 110
oC.
•
There is no need for an external heat sink if maximum ambient temperature is +70
oC.
•
An external heat sink is recommended for ambient temperatures in excess of +70
oC to insure that the
junction temperature does not exceed 110
oC maximum.
•
Use of standby mode reduces the average power dissipation proportional to the normal mode / standby
mode duty cycle and allows a higher ambient temperature before a heat sink must be used to insure that
the junction temperature does not exceed 110
oC maximum.
•
In the above table,
θ
JA is presented according to JEDEC JESD 51-2 (natural convection) and 51-6 (forced
convection). Thermal simulation assumes the package is mounted on the test board specified by JEDEC
JESD51-9 (101.6X114.3X1.6 mm, four layers).
Note:
θ
JC: Thermal resistance from junction to case.
θ
JA: Thermal resistance from junction to ambient.
Figure 2: Standby Mode Operational Truth Table
Control Signal
Normal Mode
Standby Mode
STDBY_P
L
H
STDBY_N
H
L
Figure 3: Standby/Normal Mode Timing
STDBY_P
STDBY_N
<5
µS
<5
µS
Normal Mode
Standby
Mode
Standby
Mode
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