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FAN5308 Rev. 1.0.1

Recommended Operating Conditions

Notes:

1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure

to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are referenced to AGND.

2. Junction to ambient thermal resistance,

via used, diameter of via used, available copper surface, and attached heat sink characteristics.

3. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

4. Refer to the applications section for further details.

Parameter

Min

Max

Unit

-0.3

7

V

Voltage On Any Other Pin

-0.3

V

Lead Soldering Temperature (10 seconds)

260

°C

Junction Temperature

150

°C

Storage Temperature

-65

150

°C

Thermal Resistance-Junction to Tab (

8

°C/W

Electrostatic Discharge Protection (ESD) Level (Note 3)

HBM

4

kV

CDM

1

Parameter

Min

Typ

Max

Unit

Supply Voltage Range

2.5

5.5

V

Output Voltage Range, Adjustable Version

0.8

V

Output Current

800

mA

Inductor (Note 4)

3.3

µH

Input Capacitor (Note 4)

10

µF

Output Capacitor (Note 4)

2 x 10

µF

Operating Ambient Temperature Range

-40

+85

°C

Operating Junction Temperature Range

-40

+125

°C