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SN74AUP1G58 Scheda tecnica(PDF) 1 Page - Texas Instruments

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Il numero della parte SN74AUP1G58
Spiegazioni elettronici  LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE
Download  18 Pages
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

SN74AUP1G58 Scheda tecnica(HTML) 1 Page - Texas Instruments

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FEATURES
3
2
4
6
1
In1
In2
Y
GND
In0
DBV PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
6
1
In1
In2
Y
GND
In0
3
2
4
6
1
In1
In2
Y
GND
In0
In1
In0
In2
Y
GND
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
1
4
2
3
6
VCC
VCC
VCC
5
VCC
5
5
5
DESCRIPTION/ORDERING INFORMATION
SN74AUP1G58
LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE
SCES504D – NOVEMBER 2003 – REVISED JUNE 2005
Optimized for 3.3-V Operation
Available in the Texas Instruments
3.6-V I/O Tolerant to Support Mixed-Mode
NanoStar™ and NanoFree™ Packages
Signal Operation
Low Static-Power Consumption
tpd = 5.5 ns Max at 3.3 V
(ICC = 0.9 µA Max)
Suitable for Point-to-Point Applications
Low Dynamic-Power Consumption
Latch-Up Performance Exceeds 100 mA Per
(Cpd = 4.6 pF Typ at 3.3 V)
JESD 78, Class II
Low Input Capacitance (Ci = 1.5 pF Typ)
ESD Performance Tested Per JESD 22
Low Noise - Overshoot and Undershoot <10%
– 2000-V Human-Body Model
of VCC
(A114-B, Class II)
Ioff Supports Partial-Power-Down Mode
– 200-V Machine Model (A115-A)
Operation
– 1000-V Charged-Device Model (C101)
Includes Schmitt-Trigger Inputs
ESD Protection Exceeds ±5000 V With
Wide Operating VCC Range of 0.8 V to 3.6 V
Human-Body Model
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire VCC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity,
which produces very low undershoot and overshoot characteristics.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
Tape and reel
SN74AUP1G58YEPR
0.23-mm Large Bump – YEP
_ _ _HJ_
NanoFree™ – WCSP (DSBGA)
Tape and reel
SN74AUP1G58YZPR
0.23-mm Large Bump – YZP (Pb-free)
–40°C to 85°C
SOT (SOT-23) – DBV
Tape and reel
SN74AUP1G58DBVR
H58_
SOT (SC-70) – DCK
Tape and reel
SN74AUP1G58DCKR
HJ_
SOT (SOT-553) – DRL
Reel of 4000
SN74AUP1G58DRLR
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
⋅ = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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