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LA-W51M Scheda tecnica(PDF) 11 Page - OSRAM GmbH |
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LA-W51M Scheda tecnica(HTML) 11 Page - OSRAM GmbH |
11 / 15 page Vorläufige Daten / Preliminary Data LR W51M, LA W51M, LY W51M 2009-12-16 11 Empfohlenes Lötpaddesign 6) Seite 15 Selektivlöten Recommended Solder Pad 6) page 15 selective soldering Anm.: Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Für weitere Informationen bezüglich Löten verwenden Sie bitte die Applikationsschrift "Mounting Guideline for Golden Dragon with Lens" Note: Package not suitable for ultra sonic cleaning. Further Information about Soldering please refere to Application Note "Mounting Guideline for Golden Dragon with Lens" Thermal enhanced PCB Thermisch optimiertes PCB 2 Lötstellen 2 solder points 2.3 (0.091) 13.0 (0.512) ø4.0 (0.157) Heatsink attach 13.0 (0.512) ø4.0 (0.157) Kupfer Copper 2.3 (0.091) OHPY2988 Lötstopplack Solder resist Bare Copper Freies Kupfer Geeignete thermische Anbindung notwendig Appropriate thermal connecting necessary |
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