Millimeter Wave Precision

Fixed Attenuator Die

Page 2 of 4

Notes

A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.

B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.

C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled

to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp

KAT-3-D+

Product Features

• Wide bandwidth, DC to 43.5 GHz

• Excellent attenuation accuracy & flatness

• Exceptional power handling, up to 2W

REV. A

M164399

KAT-3-D+

RS/CP/AM

171017

Typical Applications

• Cellular

• PCS

• Communications

• Radar

• Defense

• 5G

50Ω

2W 3dB

DC to 43.5 GHz

+RoHS Compliant

The +Suffix identifies RoHS Compliance. See our web site

for RoHS Compliance methodologies and qualifications

General Description

KAT-3-D+ is an absorptive attenuator Die fabricated using highly repetitive MMIC process including thin film

resistors on GaAs substrate. KAT-3-D+ attenuator Die contains through-wafer vias to realize low thermal

resistance and wideband operation.

Simplified Schematic

Ordering Information: Refer to Last Page

Bonding Pad Position / Description

Pad #

Description

2

RF-IN

5

RF-OUT

1,3,4,6

Ground

Die bottom

Ground

(Numbers on bond pads are for identification only, not marked on Die)

0

L2

L3

L4

L1

H1

0

H3

H2

0

1

2

3

4

6

5

Die dimensions in µm

L1

L2

L3

L4

H1

H2

H3

Thickness

Bond pad size

125

375

625

750

85

615

700

100

125 x 100

Note: 1. Bond Pad material - Gold

2. Bottom of Die - Gold plated