© Koninklijke Philips Electronics N.V. 2004.

Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner.

The information presented in this document does not form part of any quotation or

contract, is believed to be accurate and reliable and may be changed without notice. No

liability will be accepted by the publisher for any consequence of its use. Publication

thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 06 February 2004

Document order number: 9397 750 10779

Contents

Philips Semiconductors

TDA8947J

4-channel audio amplifier

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

6

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

7.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8

Functional description . . . . . . . . . . . . . . . . . . . 5

8.1

Input configuration . . . . . . . . . . . . . . . . . . . . . . 5

8.2

Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.2.1

Output power measurement . . . . . . . . . . . . . . . 6

8.2.2

Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.3

Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.4

Supply voltage ripple rejection . . . . . . . . . . . . . 7

8.5

Built-in protection circuits . . . . . . . . . . . . . . . . . 8

9

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

10

Thermal characteristics. . . . . . . . . . . . . . . . . . . 8

11

Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

12

Dynamic characteristics . . . . . . . . . . . . . . . . . . 9

13

Application information. . . . . . . . . . . . . . . . . . 15

13.1

Application diagrams . . . . . . . . . . . . . . . . . . . 15

13.2

Printed-circuit board . . . . . . . . . . . . . . . . . . . . 17

13.2.1

Layout and grounding . . . . . . . . . . . . . . . . . . . 17

13.2.2

Power supply decoupling . . . . . . . . . . . . . . . . 17

13.3

Thermal behavior and heatsink calculation . . 18

14

Test information . . . . . . . . . . . . . . . . . . . . . . . . 19

14.1

Quality information . . . . . . . . . . . . . . . . . . . . . 19

15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

16

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

16.1

Introduction to soldering through-hole

mount packages . . . . . . . . . . . . . . . . . . . . . . 21

16.2

Soldering by dipping or by solder wave . . . . . 21

16.3

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21

16.4

Package related soldering information . . . . . . 21

17

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22

18

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23

19

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

20

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23