LSM330 datasheet(1/75 Pages) STMICROELECTRONICS

Il numero della parte	LSM330

Spiegazioni elettronici	Power-down and sleep modes

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Produttore elettronici	STMICROELECTRONICS [STMicroelectronics]

Homepage	http://www.st.com

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1 / 75 page

This is information on a product in full production.

December 2013

DocID023426 Rev 3

1/75

LSM330

iNEMO inertial module:

3D accelerometer and 3D gyroscope

Datasheet

- production data

Features

 Analog supply voltage: 2.4 V to 3.6 V

 Digital supply voltage IOs: 1.8 V

 Power-down and sleep modes

 2 embedded programmable state machines

 3 independent acceleration channels and 3

angular rate channels

 ±2/±4/±6/±8/±16 g selectable full scale

 ±250/±500/±2000 dps selectable full scale

 SPI/I2C serial interface

 Embedded temperature sensor

 Embedded FIFO

 ECOPACK® RoHS and “Green” compliant

Applications

 GPS navigation systems

 Impact recognition and logging

 Gaming and virtual reality input devices

 Motion-activated functions

 Intelligent power saving for handheld devices

 Vibration monitoring and compensation

 Free-fall detection

 6D orientation detection

Description

The LSM330 is a system-in-package featuring a

3D digital accelerometer with two embedded state

machines that can be programmed to implement

autonomous applications and a 3D digital

gyroscope.

ST’s family of MEMS sensor modules leverages

the robust and mature manufacturing processes

already used for the production of micromachined

accelerometers and gyroscopes.

The various sensing elements are manufactured

using specialized micromachining processes,

while the IC interfaces are developed using

CMOS technology that allows the design of a

dedicated circuit which is trimmed to better match

the sensing element characteristics.

The LSM330 has a user-selectable full-scale

acceleration range of ±2/±4/±6/±8/±16 g and an

angular rate range of ±250/±500/±2000 dps. The

accelerometer and gyroscope sensors can be

either activated or separately put in power-down /

sleep mode for applications optimized for power

saving.

The LSM330 is available in a plastic land grid

array (LGA) package.

LGA-24L (3x3.5x1 mm)

Table 1. Device summary

Part

number

Temperature

range [°C]

Package

Packing

LSM330

-40 to +85

LGA-24L

(3x3.5x1mm)

Tray

LSM330TR

-40 to +85

Tape

and reel

www.st.com

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